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Molex Electronics Ltd.
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| Part No. |
71764-0114
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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| File Size |
121.23K /
5 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10114829-10114LF
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| Description |
1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0120
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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| File Size |
121.16K /
5 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114831-10114LF
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| Description |
1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114828-10114LF
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| Description |
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0024
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| Description |
2.54mm (.100) Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 24 Circuits
2.54mm (.100") Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 24 Circuits
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| File Size |
120.83K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114830-10114LF
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| Description |
1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0026
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, Tin (Sn) Plating
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| File Size |
121.06K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114508-D0J-20DLF
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| Description |
XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0104
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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| File Size |
121.22K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114828-10102LF
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| Description |
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0108
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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| File Size |
121.01K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114868-L0J-10DLF
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| Description |
XCede® High Speed Backplane Connectors, 3 wall left header.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0116
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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| File Size |
121.10K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114508-00J-20DLF
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| Description |
XCede® High Speed Backplane Connectors, 2 wall header.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0118
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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| File Size |
120.86K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114492-008LF
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| Description |
HPCE R/A REC 32P24S
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0106
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 6 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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| File Size |
121.09K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114868-10J-10DLF
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| Description |
XCede® High Speed Backplane Connectors, 4 wall header.
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| Tech specs |
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Official Product Page
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