5608 pdf Datasheet P11 Part Num --- IC-ON-LINE


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5608 Datasheet PDF File

For 5608 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |

					Samsung semiconductor
Part No.	K9F5608D0D-PCB00 K9F5608X0D
Description	32M x 8 Bit NAND Flash Memory 32M X 8 FLASH 2.7V PROM, 30 ns, PDSO48
File Size	755.48K / 35 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10136656-0821LF
Description	Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Gold Flash plating, 8 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Sanyo Semiconductor Corp SANYO[Sanyo Semicon Device]
Part No.	LM85608BNBSP LM85608B LM8560 LM8560B LM8560N
Description	LM8560N, 8560B PMOS LSI Digital Alarm Clock From old datasheet system
File Size	190.76K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10136656-0811LF
Description	Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Tin plating, 8 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs				Official Product Page

					SAMSUNG SEMICONDUCTOR CO. LTD. Samsung Semiconductor Co., Ltd.
Part No.	K4T56083QF-GCD5 K4T56083QF-ZCD5 K4T56043QF-GCD5 K4T56043QF-ZCD5
Description	256Mb F-die DDR2 SDRAM OSC 3.3V SMT 7X5 CMOS 256Mb的的F - DDR2内存芯片
File Size	479.59K / 27 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	75160-156-08LF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,8 position, 2.54mm pitch
Tech specs				Official Product Page

					Agilent (Hewlett-Packard) HP[Agilent(Hewlett-Packard)]
Part No.	HDSP-5503 HDSP-H158 HDSP-5301 HDSP-5303 HDSP-5307 HDSP-5308 HDSP-5321 HDSP-5323 HDSP-5501 HDSP-5507 HDSP-5508 HDSP-5521 HDSP-5523 HDSP-5601 HDSP-5603 HDSP-5608 HDSP-5621 HDSP-5623 HDSP-5701 HDSP-5703 HDSP-5707 HDSP-5708 HDSP-5721 HDSP-5723 HDSP-H151 HDSP-H153 HDSP-H157
Description	14.2 mm (0.56 inch) Seven Segment Displays
File Size	242.61K / 8 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10136656-0812LF
Description	Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Tin plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor]
Part No.	K4H560838E-GCCC K4H560438E-GCC4 K4H560438E-GCCC K4H560838E-GCC4
Description	DIODE ZENER SINGLE 300mW 27Vz 5mA-Izt 0.02503 0.05uA-Ir 21 SOT-23 3K/REEL 256Mb的电子芯片的DDR 400内存规格60Ball FBGA封装（x4/x8 DIODE ZENER SINGLE 300mW 29.8Vz 5mA-Izt 0.02503 0.05uA-Ir 23 SOT-23 3K/REEL 256Mb E-die DDR 400 SDRAM Specification 60Ball FBGA (x4/x8)
File Size	195.42K / 18 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10136656-0832NLF
Description	Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 8 Positions, Natural Color, Non GW Compatible LCP, Tray packing.
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd.
Part No.	K4H560438E-ZLB30 K4H560838E-ZLB30
Description	64M X 4 DDR DRAM, 0.7 ns, PBGA60 ROHS COMPLIANT, FBGA-60 32M X 8 DDR DRAM, 0.7 ns, PBGA60 ROHS COMPLIANT, FBGA-60
File Size	385.02K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10136656-0842LF
Description	Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 30u\\ Gold (Tin on Tails) plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	A-7720-WD08F501B 0022456087 22-45-6087
Description	2.54mm (.100) KK IDT Double Cantilever Contact, 8 Circuits, Gold (Au), Feed-To, 22 AWG Wire
File Size	476.92K / 20 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10136656-0822LF
Description	Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Gold Flash plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	A-7720-WC08F501B 0022456086 22-45-6086
Description	2.54mm (.100) KK? IDT Double Cantilever Contact, 8 Circuits, Gold (Au), FeedThrough, 22 AWG Wire
File Size	484.66K / 20 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10136656-0832LF
Description	Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	A-7720-WA08F501B 0022456081 22-45-6081
Description	2.54mm (.100") KK庐 IDT Double Cantilever Contact, 8 Circuits, Gold (Au), Feed-Through, 22 AWG Wire 2.54mm (.100) KK? IDT Double Cantilever Contact, 8 Circuits, Gold (Au), Feed-Through, 22 AWG Wire
File Size	476.94K / 20 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10136656-0842NLF
Description	Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 30u\\ Gold (Tin on Tails) plating, 8 Positions, Natural Color, Non GW Compatible LCP, Tray packing.
Tech specs				Official Product Page


Part No.	K9F5608U0C-DIB0 K9F5616U0C-DIB0
Description	32M X 8 FLASH 2.7V PROM, 30 ns, PBGA63 16M X 16 FLASH 2.7V PROM, 30 ns, PBGA63
File Size	728.30K / 33 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10136656-0811NLF
Description	Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Tin plating, 8 Positions, Natural Color, GW Compatible LCP, Tray packing.
Tech specs				Official Product Page

For 5608 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |

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