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Amphenol Communications Solutions |
Part No. |
68015-125HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 25 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0757571342 75757-1342
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Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 8 Circuits, 0.75μm (30μ) Select Gold (Au) Plating, 11.20mm (.441) Mating Pin Length 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 8 Circuits, 0.75μm (30μ) Select Gold (Au) Plating, 11.20mm (.441) Mating Pin Length MOLEX Connector
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File Size |
166.66K /
4 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68015-113HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 13 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68015-103
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 3 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
75757-6261 0757576261
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Description |
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, 1.25μm(50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 1.25μm(50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on
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File Size |
166.28K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68015-103HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 3 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0757571101 75757-1101
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Description |
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 20 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length 3.50mm (.138) Pitch, MX150垄芒 Header, Breakaway, Vertical, 20 Circuits, 2.5楼矛m (100楼矛) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length
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File Size |
166.58K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68015-136
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
75757-0352 0757570352
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Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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File Size |
99.22K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68015-104HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0757571201 75757-1201
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Description |
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, Gold (Au) Flash Plating 3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, Gold (Au) Flash Plating
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File Size |
166.56K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68015-136H
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
75757-0322 0757570322
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Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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File Size |
98.95K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68015-110HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 10 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68015-119HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 19 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0757571181 75757-1181
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Description |
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 16 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length 3.50mm (.138) Pitch, MX150垄芒 Header, Breakaway, Vertical, 16 Circuits, 2.5楼矛m (100楼矛) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length
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File Size |
166.63K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68015-101HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 1 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Price and Availability
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