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  75757-0151 Datasheet PDF File

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    0757570151 75757-0151

Molex Electronics Ltd.
Part No. 0757570151 75757-0151
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating Overall
MOLEX Connector

File Size 99.39K  /  3 Page

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Amphenol Communications Solutions

Part No. 68015-125HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 25 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    75757-5261

Molex Electronics Ltd.
Part No. 75757-5261
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 166.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-113HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 13 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    75757-1441

Molex Electronics Ltd.
Part No. 75757-1441
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 8 Circuits, 1.5μm (60μ)Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.43K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-103
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 3 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    75757-0362

Molex Electronics Ltd.
Part No. 75757-0362
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 99.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 68015-103HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 3 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    75757-1382

Molex Electronics Ltd.
Part No. 75757-1382
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 0.75μm(30μ) Select Gold (Au) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187)

File Size 166.47K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-136
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    75757-5281

Molex Electronics Ltd.
Part No. 75757-5281
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 158.58K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-104HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    75757-1481

Molex Electronics Ltd.
Part No. 75757-1481
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.43K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-136H
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    75757-5161

Molex Electronics Ltd.
Part No. 75757-5161
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length

File Size 166.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-110HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    75757-1302

Molex Electronics Ltd.
Part No. 75757-1302
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 20 Circuits, 0.75μm (30μ) Select Gold (Au) Plating, 11.20mm (.441) Mating Pin Length

File Size 166.40K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-119HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 19 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    75757-0361

Molex Electronics Ltd.
Part No. 75757-0361
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 99.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 68015-101HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 1 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 75757-0151 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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