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Molex Electronics Ltd.
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Part No. |
75757-1461 0757571461
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Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
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File Size |
166.43K /
4 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68015-125HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 25 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0757571161 75757-1161
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Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length 3.50mm (.138) Pitch, MX150垄芒 Header, Breakaway, Vertical, 12 Circuits, 2.5楼矛m (100楼矛) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length
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File Size |
166.64K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68015-113HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 13 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
75757-1462 0757571462
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Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187) PC Tail Length 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187) PC Tail Length
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File Size |
166.45K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68015-103
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 3 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68015-103HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 3 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68015-136
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
75757-0331 0757570331
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Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68015-104HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
75757-0332 0757570332
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Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68015-136H
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
75757-0341 0757570341
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Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68015-110HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 10 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68015-119HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 19 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
75757-1401 0757571401
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Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 20 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
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File Size |
166.40K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68015-101HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 1 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Price and Availability
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