5608 pdf Datasheet P15 Part Num --- IC-ON-LINE


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5608 Datasheet PDF File

For 5608 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |

					SANYO[Sanyo Semicon Device]
Part No.	LC865608 LC865612 LC865616 LC865620 LC865624 LC865628 LC86E5632 LC865632
Description	8-Bit Single Chip Microcontroller with the One-Time Programmable UVEPROM
File Size	668.40K / 21 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10136656-0821LF
Description	Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Gold Flash plating, 8 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor] Samsung Electronic
Part No.	K4S560432E-NC75 K4S560832E-NC75 K4S560832E-NL75 K4S561632E K4S560432E-NC K4S560432E-NL75
Description	256Mb E-die SDRAM Specification 54pin sTSOP-II 256Mb的电子芯片内存规4pin sTSOP -
File Size	180.64K / 13 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10136656-0811LF
Description	Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Tin plating, 8 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs				Official Product Page

					Atmel, Corp. ATMEL CORP TEMIC SEMICONDUCTORS
Part No.	CL0-65608V-70SHXXXD CL0-65608V-70SHXXXR CL39-65608V-70SHXXX CL0-65608V-55SHXXXD CL0-65608V-70R CL39-65608V-70D CL0-65608V-45SHXXX CL0-65608V-70D CL0-65608V-45SHXXXRD CL0-65608V-70SHXXXRD CL0-65608V-55SHXXXR CL0-65608V-55SHXXXRD CL0-65608V-45SHXXXD ML0-65608L-55P883D ML0-65608L-55/883R ML0-65608L-55/883D CL0-65608L-45R CL0-65608L-45SHXXXR
Description	128K X 8 STANDARD SRAM, 70 ns, PDIP32 128K X 8 STANDARD SRAM, 55 ns, UUC31 DIE 128K X 8 STANDARD SRAM, 45 ns, UUC31 DIE 128K X 8 STANDARD SRAM, 70 ns, UUC31 DIE
File Size	520.62K / 10 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	75160-156-08LF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,8 position, 2.54mm pitch
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	K4H560438J-LC/LB0 K4H560438J-LC/LB3 K4H560838J-LC/LCC K4H561638J-LC/LB3 K4H561638J-LC/LCC K4H560838J-LC/LB3
Description	256Mb J-die DDR SDRAM Specification
File Size	352.76K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10136656-0812LF
Description	Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Tin plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor] Samsung Electronic
Part No.	K4S561632E-UC75 K4S561632E-UL75 K4S561632E-UL60 K4S561632E-UC60 K4S560832E-UC75 K4S560832E-UL75 K4S560432E-UC K4S560432E-UC75 K4S560432E-UL75
Description	256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) 256Mb的电子芯片与内存规格4 TSOP-II免费（符合RoHS
File Size	196.27K / 14 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10136656-0832NLF
Description	Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 8 Positions, Natural Color, Non GW Compatible LCP, Tray packing.
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor]
Part No.	K4S560432E-TC K4S560432E-TC75 K4S561632E-TL75 K4S560432E-TL75 K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60
Description	256Mb E-die SDRAM Specification 256Mb的电子芯片内存规
File Size	194.54K / 14 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10136656-0842LF
Description	Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 30u\\ Gold (Tin on Tails) plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60 K4S561632E-TL75 K4S560432E-TL75 K4S560432E-TC75 K4S560432E-TC
Description	256Mb E-die SDRAM Specification 54pin sTSOP-II
File Size	196.59K / 14 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10136656-0822LF
Description	Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Gold Flash plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K4S560832E-NCL75 K4S561632E-NCL60 K4S561632E-NCL75 K4S560432E-NC K4S560432E-NCL75 K4S561632E-NC75
Description	16M x 16 SDRAM, LVTTL, 133MHz 256Mb E-die SDRAM Specification 54pin sTSOP-II
File Size	205.22K / 14 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10136656-0832LF
Description	Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs				Official Product Page

					http:// Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K4H560438D-GCA2 K4H561638D-GLB3 K4H560838D-GLB3 K4H561638D-GCA2 K4H561638D-GLB0 K4H560438D-GLB0 K4H560438D-GLB3 K4H560838D-GLB0 K4H560838D-GCB3 K4H560838D-GCA2 K4H561638D-GLA2
Description	DIODE ZENER SINGLE 200mW 33Vz 0.05mA-Izt 0.05 0.05uA-Ir 25 SOD-323 3K/REEL 的DDR 256Mb DIODE ZENER SINGLE 500mW 28Vz 0.05mA-Izt 0.05 0.05uA-Ir 21.2 SOD-123 3K/REEL 的DDR 256Mb DIODE ZENER SINGLE 200mW 30Vz 0.05mA-Izt 0.05 0.05uA-Ir 22.8 SOD-323 3K/REEL 的DDR 256Mb DIODE ZENER SINGLE 500mW 36Vz 0.05mA-Izt 0.05 0.05uA-Ir 27.3 SOD-123 3K/REEL 的DDR 256Mb DIODE ZENER SINGLE 150mW 36Vz 0.05mA-Izt 0.05 0.05uA-Ir 27.3 SOD-523 3K/REEL 的DDR 256Mb DIODE ZENER SINGLE 150mW 33Vz 0.05mA-Izt 0.05 0.05uA-Ir 25 SOD-523 3K/REEL 的DDR 256Mb DIODE ZENER SINGLE 200mW 36Vz 0.05mA-Izt 0.05 0.05uA-Ir 27.3 SOD-323 3K/REEL DIODE ZENER SINGLE 200mW 28Vz 0.05mA-Izt 0.05 0.05uA-Ir 21.2 SOD-323 3K/REEL DIODE ZENER SINGLE 500mW 39Vz 0.05mA-Izt 0.05 0.05uA-Ir 29.6 SOD-123 3K/REEL DIODE ZENER SINGLE 200mW 39Vz 0.05mA-Izt 0.05 0.05uA-Ir 29.6 SOD-323 3K/REEL
File Size	293.31K / 26 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10136656-0842NLF
Description	Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 30u\\ Gold (Tin on Tails) plating, 8 Positions, Natural Color, Non GW Compatible LCP, Tray packing.
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K4H561638D-TC_LB0 K4H560838D-TC_LA0 K4H560838D-TC_LA2 K4H560838D-TC_LB3 K4H560838D-TC_LB0 K4H561638D-TC_LA0 K4H561638D-TC_LA2 K4H561638D-TC_LB3 K4H560438D-TC_LB3 K4H560438D-TC K4H560438D-TC_LA0 K4H560438D-TC_LA2 K4H560438D-TC_LB0 K4H561638D-TC/LA2 K4H561638D-TC/LB0 K4H561638D-TC/LA0 K4H561638D-TC/LB3
Description	256MB
File Size	233.83K / 25 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10136656-0811NLF
Description	Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Tin plating, 8 Positions, Natural Color, GW Compatible LCP, Tray packing.
Tech specs				Official Product Page

For 5608 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |

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