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For 120sec Found Datasheets File :: 774    Search Time::1.297ms    
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    HBTGFR421-KR

Seoul Semiconductor
Part No. HBTGFR421-KR
OCR Text ...c. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. 260 c max. 10 sec. max. o 60sec. max. above 220 c 120sec. max. pre-heating 150~200 c 1~5 c / sec. o o o o 1~5 c / sec. ...
Description 1.6*1.5*0.5 mm Untited, Diffused flat mold Wavelength: -.Red: 625nm Green: 525nm Blue: 472nm

File Size 1,350.06K  /  13 Page

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    GR101

Seoul Semiconductor
Part No. GR101
OCR Text ...c. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. 260 c max. 10 sec. max. o 60sec. max. above 220 c 120sec. max. pre-heating 150~200 c 1~5 c / sec. o o o o 1~5 c / sec. ...
Description 1.6*0.8*0.8 mm Untinted, Diffused flat mold Dominant Wavelength: 570nm

File Size 281.50K  /  13 Page

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    FAT801-S

Seoul Semiconductor
Part No. FAT801-S
OCR Text ...c. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. 260 c max. 10 sec. max. o 60sec. max. above 220 c 120sec. max. pre-heating 150~200 c 1~5 c / sec. o o o o 1~5 c / sec. lea...
Description Industry Standard PLCC SMT package

File Size 252.85K  /  13 Page

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    YG104-ICH

Seoul Semiconductor
Part No. YG104-ICH
OCR Text ...c. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. 260 c max. 10 sec. max. o 60sec. max. above 220 c 120sec. max. pre-heating 150~200 c 1~5 c / sec. o o o o 1~5 c / sec. ...
Description Surface-mounted chip LED device

File Size 273.10K  /  13 Page

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    YG104-IC112

Seoul Semiconductor
Part No. YG104-IC112
OCR Text ...c. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. 260 c max. 10 sec. max. o 60sec. max. above 220 c 120sec. max. pre-heating 150~200 c 1~5 c / sec. o o o o 1~5 c / sec. ...
Description Surface-mounted chip LED device
Small size suitable for compact

File Size 273.01K  /  13 Page

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    FB102

Seoul Semiconductor
Part No. FB102
OCR Text ...c. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. 260 c max. 10 sec. max. o 60sec. max. above 220 c 120sec. max. pre-heating 150~200 c 1~5 c / sec. o o o o 1~5 c / sec. ...
Description 1.6*0.8*0.6 mm Untinted, Diffused flat mold

File Size 279.38K  /  13 Page

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    ERT801-S

Seoul Semiconductor
Part No. ERT801-S
OCR Text ...c. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. 260 c max. 10 sec. max. o 60sec. max. above 220 c 120sec. max. pre-heating 150~200 c 1~5 c / sec. o o o o 1~5 c / sec. lea...
Description Industry Standard PLCC SMT package Available in multiple colors

File Size 281.71K  /  13 Page

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    HB[HB Electronic Components]
Part No. 0603KRCT
OCR Text ... Soldering : Pre-heat 120~150C, 120sec. MAX., Peak temperature : 240C Max. Soldering time : 10 sec Max. Soldering Iron : (Not recommended) Temperature 300C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W M...
Description SURFACE MOUNT DEVICE LED

File Size 686.19K  /  10 Page

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    HB[HB Electronic Components]
Part No. 0603LBCT
OCR Text ... Soldering : Pre-heat 120~150C, 120sec. MAX., Peak temperature : 240C Max. Soldering time : 10 sec Max. Soldering Iron : (Not recommended) Temperature 300C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W M...
Description SURFACE MOUNT DEVICE LED

File Size 688.73K  /  10 Page

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    HB Electronic Component...
HB[HB Electronic Components]
Part No. 0603LGCT
OCR Text ... Soldering : Pre-heat 120~150C, 120sec. MAX., Peak temperature : 240C Max. Soldering time : 10 sec Max. Soldering Iron : (Not recommended) Temperature 300C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W M...
Description    SURFACE MOUNT DEVICE LED

File Size 789.47K  /  10 Page

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