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For 120sec Found Datasheets File :: 761    Search Time::0.985ms    
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    MTSM0302AZ-HR-A

Marktech Corporate
Part No. MTSM0302AZ-HR-A
OCR Text ...w Soldering Lead Solder 120~150 120sec. Max. 240 Max. 10sec. Max. refer to Temperatureprofile 1 *After reflow soldering rapid cooling should be avoided. Pre-heat Pre-heat time Peak temperature Soldering time Condition [Temperature-profile (...
Description 1.8mm AXIAL LED LAMP

File Size 219.19K  /  7 Page

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    MSL-1947HB3

Unity Opto Technology
Part No. MSL-1947HB3
OCR Text ...ec. Pre-heating 120~150oC 120sec. Max. Time Unity Opto Technology Co., Ltd. 04/02/2003 MSL-1947HB3 Recommended Soldering Conditions 1.Reflow Soldering (1).The Fig. 1 temperature profile shall be at the surface of LED res...
Description Surface Mount Chip LEDs

File Size 64.72K  /  9 Page

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    意法半导
STMICROELECTRONICS[STMicroelectronics]
Part No. SD1563 2839
OCR Text ...63 TYPICAL PERFORMANCE (P.W. = 120sec) POWER OUTPUT vs POWER INPUT POWER GAIN vs FREQUENCY POWER OUTPUT vs COLLECTOR VOLTAGE EFFICIENCY vs POWER INPUT 3/7 SD1563 TYPICAL PERFORMANCE (P.W. = 120sec) EFFICIENCY vs FREQUENC...
Description RF & Microwave Transistors UHF Pulsed Applications(用于超高频脉冲的RF和微波晶体管)
From old datasheet system

File Size 105.04K  /  7 Page

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    MTSM735K-UR-A

Marktech Corporate
Part No. MTSM735K-UR-A
OCR Text ... 180~200 Pre-heat Pre-heat time 120sec. Max. 120sec. Max. 240 Max. 260 Max. Peak temperature Soldering time 10sec. Max. 10sec. Max. Condition refer to refer to TemperatureTemperatureprofile 1 profile 2 *After reflow soldering rapid cooling ...
Description 3.2 x 2.8mm SMD TYPE

File Size 205.06K  /  7 Page

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    MSL-1947HB3-S

Unity Opto Technology
Part No. MSL-1947HB3-S
OCR Text ... 6 K/s Ramp-up rate up to 6 K/s 120sec. Max. Defined for Preconditioning:2-3 K/s Time Unity Opto Technology Co., Ltd. 10/16/2003 MSL-1947HB3-S Recommended Soldering Conditions 1.Reflow Soldering (1).The Fig. 1 temperature prof...
Description Surface Mount Chip LEDs

File Size 74.19K  /  10 Page

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    YGHR411-H

Seoul Semiconductor
Part No. YGHR411-H
OCR Text ...c. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. 260 c max. 10 sec. max. o 60sec. max. above 220 c 120sec. max. pre-heating 150~200 c 1~5 c / sec. o o o o 1~5 c / sec. ...
Description Surface-mounted chip LED device

File Size 307.44K  /  13 Page

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    YG202

Seoul Semiconductor
Part No. YG202
OCR Text ...c. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. 260 c max. 10 sec. max. o 60sec. max. above 220 c 120sec. max. pre-heating 150~200 c 1~5 c / sec. o o o o 1~5 c / sec. ...
Description Surface-mounted chip LED device

File Size 273.37K  /  13 Page

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    HB Electronic Component...
Part No. L-C150KGCT
OCR Text ... Soldering : Pre-heat 120~150C, 120sec. MAX., Peak temperature : 240C Max. Soldering time : 10 sec Max. Soldering Iron : (Not recommended) Temperature 300C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W M...
Description SURFACE MOUNT DEVICE LED

File Size 697.99K  /  10 Page

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    HB Electronic Component...
Part No. L-C150KRCT
OCR Text ... Soldering : Pre-heat 120~150C, 120sec. MAX., Peak temperature : 240C Max. Soldering time : 10 sec Max. Soldering Iron : (Not recommended) Temperature 300C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W M...
Description SURFACE MOUNT DEVICE LED

File Size 734.00K  /  10 Page

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    HBTGFR421-W

Seoul Semiconductor
Part No. HBTGFR421-W
OCR Text ...c. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. 260 c max. 10 sec. max. o 60sec. max. above 220 c 120sec. max. pre-heating 150~200 c 1~5 c / sec. o o o o 1~5 c / sec. ...
Description 1.6*1.5*0.5 mm Untited, Diffused flat mold

File Size 1,532.56K  /  14 Page

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