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  42376-0114 Datasheet PDF File

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    42376-0043

Molex Electronics Ltd.
Part No. 42376-0043
Description 2.54mm (.100") Pitch KK垄莽 Header, Breakaway, Right Angle, 8 Circuits, 0.38楼矛m (15楼矛") 2.54mm (.100") Pitch KK垄莽 Header, Breakaway, Right Angle, 8 Circuits, 0.38

File Size 301.86K  /  12 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    42376-0011

Molex Electronics Ltd.
Part No. 42376-0011
Description 2.54mm (.100") Pitch KK Header, Breakaway, Right Angle, 11 Circuits, Tin (Sn) Plating

File Size 301.83K  /  12 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    42376-0041

Molex Electronics Ltd.
Part No. 42376-0041
Description 2.54mm (.100") Pitch KK垄莽 Header, Breakaway, Right Angle, 6 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating, Mating Pin Length 9.17mm (.361")

File Size 301.85K  /  12 Page

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Amphenol Communications Solutions

Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    42376-0020

Molex Electronics Ltd.
Part No. 42376-0020
Description 2.54mm (.100") Pitch KK Header, Breakaway, Right Angle, 20 Circuits, Tin (Sn) Plating

File Size 301.83K  /  12 Page

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Amphenol Communications Solutions

Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    42376-0022

Molex Electronics Ltd.
Part No. 42376-0022
Description 2.54mm (.100") Pitch KK垄莽 Header, Breakaway, Right Angle, 22 Circuits, Tin (Sn) Plating, Mating Pin Length 9.17mm (.361")

File Size 301.60K  /  12 Page

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Amphenol Communications Solutions

Part No. 10114508-D0J-20DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs    

Official Product Page

    42376-0025

Molex Electronics Ltd.
Part No. 42376-0025
Description 2.54mm (.100") Pitch KK垄莽 Header, Breakaway, Right Angle, 25 Circuits, Tin (Sn) Plating, Mating Pin Length 9.17mm (.361")

File Size 301.83K  /  12 Page

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Amphenol Communications Solutions

Part No. 10114828-10102LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
Tech specs    

Official Product Page

    42376-0039

Molex Electronics Ltd.
Part No. 42376-0039
Description 2.54mm (.100") Pitch KK垄莽 Header, Breakaway, Right Angle, 4 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating, Mating Pin Length 9.17mm (.361")

File Size 301.85K  /  12 Page

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Amphenol Communications Solutions

Part No. 10114868-L0J-10DLF
Description XCede® High Speed Backplane Connectors, 3 wall left header.
Tech specs    

Official Product Page

    42376-0038

Molex Electronics Ltd.
Part No. 42376-0038
Description 2.54mm (.100") Pitch KK Header, Breakaway, Right Angle, 3 Circuits

File Size 301.85K  /  12 Page

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Amphenol Communications Solutions

Part No. 10114508-00J-20DLF
Description XCede® High Speed Backplane Connectors, 2 wall header.
Tech specs    

Official Product Page

    42376-0036

Molex Electronics Ltd.
Part No. 42376-0036
Description 2.54mm (.100") Pitch KK垄莽 Header, Breakaway, Right Angle, 36 Circuits, Tin (Sn) Plating, Mating Pin Length 9.17mm (.361")

File Size 301.83K  /  12 Page

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Amphenol Communications Solutions

Part No. 10114492-008LF
Description HPCE R/A REC 32P24S
Tech specs    

Official Product Page

    42376-0037

Molex Electronics Ltd.
Part No. 42376-0037
Description 2.54mm (.100") Pitch KK垄莽 Header, Breakaway, Right Angle, 2 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating, Mating Pin Length 9.17mm (.361")

File Size 301.86K  /  12 Page

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Amphenol Communications Solutions

Part No. 10114868-10J-10DLF
Description XCede® High Speed Backplane Connectors, 4 wall header.
Tech specs    

Official Product Page

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