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  71764-0220 Datasheet PDF File

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    71764-0114

Molex Electronics Ltd.
Part No. 71764-0114
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.23K  /  5 Page

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Amphenol Communications Solutions

Part No. 10134040-22000LF
Description HPCE CTB VT HEADER 4LP With latch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    71764-0226

Molex Electronics Ltd.
Part No. 71764-0226
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.93K  /  5 Page

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Amphenol Communications Solutions

Part No. 68002-201HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 1 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71764-0122 SD-71764-001

Molex Electronics Ltd.
Part No. 71764-0122 SD-71764-001
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header
2.54mm (.100") Pitch C-Grid庐 Breakaway Header

File Size 121.22K  /  5 Page

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Amphenol Communications Solutions

Part No. 68002-203HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 3 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71764-0006 SD-71764-001

Molex Electronics Ltd.
Part No. 71764-0006 SD-71764-001
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header
2.54mm (.100") Pitch C-Grid庐 Breakaway Header

File Size 121.15K  /  5 Page

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Amphenol Communications Solutions

Part No. 68002-207HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 7 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71764-0110 SD-71764-001

Molex Electronics Ltd.
Part No. 71764-0110 SD-71764-001
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header
2.54mm (.100") Pitch C-Grid庐 Breakaway Header

File Size 121.15K  /  5 Page

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Amphenol Communications Solutions

Part No. 54112-802200800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Molex, Inc.
MOLEX INC
Part No. 71764-9003 71764-0212 71764-0004 71764-0322 71764-0008 71764-0406
Description CGrid R/A Bkway Hdr Tin 6Ckt W/ Vd 5 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
CGrid R/A Bkway Hdr 30 SAu 12Ckt 12 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
717640004 4 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
CGrid R/A Bkway Hdr Tin 22Ckt 22 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
CGrid R/A Bkway Hdr Tin 8Ckt 8 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
CGrid R/A Bkway Hdr 15 SAu 6Ckt

File Size 93.64K  /  3 Page

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Amphenol Communications Solutions

Part No. 84502-201
Description 300 Position BGA Receptacle, 5.5mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    71764-0012 0717640012

Molex Electronics Ltd.
Part No. 71764-0012 0717640012
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 12 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 12 Circuits, Tin (Sn) Plating

File Size 121.14K  /  5 Page

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Amphenol Communications Solutions

Part No. 94050-220CALF
Description Assembly, Top Mount, D/D(136Pins), R/A, 5V, 2mm s/o, Right Push Rod Eject, 8mm Card Travel, Narrow Body
Tech specs    

Official Product Page

    71764-0010 0717640010

Molex Electronics Ltd.
Part No. 71764-0010 0717640010
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 10 Circuits, Tin (Sn) Plating

File Size 121.14K  /  5 Page

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Amphenol Communications Solutions

Part No. 470-2205-100
Description Receptacle. mod,20Positions, 20.5mm, NEXLEV
Tech specs    

Official Product Page

    71764-0014 0717640014

Molex Electronics Ltd.
Part No. 71764-0014 0717640014
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 14 Circuits, Tin (Sn) Plating

File Size 121.06K  /  5 Page

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Amphenol Communications Solutions

Part No. 77311-802-20LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    71764-0016 0717640016

Molex Electronics Ltd.
Part No. 71764-0016 0717640016
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, Tin (Sn) Plating

File Size 121.06K  /  5 Page

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Amphenol Communications Solutions

Part No. 51940-220LF
Description PwrBlade®, Power Supply Connectors, 12P 24S Vertical Receptacle.
Tech specs    

Official Product Page

For 71764-0220 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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