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  71764-0220 Datasheet PDF File

For 71764-0220 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    71764-0220

Molex Electronics Ltd.
Part No. 71764-0220
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.87K  /  5 Page

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Amphenol Communications Solutions

Part No. 10134040-22000LF
Description HPCE CTB VT HEADER 4LP With latch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    71764-0108

Molex Electronics Ltd.
Part No. 71764-0108
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.01K  /  5 Page

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Amphenol Communications Solutions

Part No. 68002-201HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 1 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71764-0128

Molex Electronics Ltd.
Part No. 71764-0128
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 28 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.16K  /  5 Page

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Amphenol Communications Solutions

Part No. 68002-203HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 3 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71764-0126

Molex Electronics Ltd.
Part No. 71764-0126
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.16K  /  5 Page

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Amphenol Communications Solutions

Part No. 68002-207HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 7 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71764-0004

Molex Electronics Ltd.
Part No. 71764-0004
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, Tin (Sn) Plating

File Size 121.13K  /  5 Page

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Amphenol Communications Solutions

Part No. 54112-802200800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71764-0130

Molex Electronics Ltd.
Part No. 71764-0130
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 30 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.01K  /  5 Page

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Amphenol Communications Solutions

Part No. 84502-201
Description 300 Position BGA Receptacle, 5.5mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    71764-0008

Molex Electronics Ltd.
Part No. 71764-0008
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 8 Circuits, Tin (Sn) Plating

File Size 121.06K  /  5 Page

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Amphenol Communications Solutions

Part No. 94050-220CALF
Description Assembly, Top Mount, D/D(136Pins), R/A, 5V, 2mm s/o, Right Push Rod Eject, 8mm Card Travel, Narrow Body
Tech specs    

Official Product Page

    71764-0120

Molex Electronics Ltd.
Part No. 71764-0120
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.16K  /  5 Page

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Amphenol Communications Solutions

Part No. 470-2205-100
Description Receptacle. mod,20Positions, 20.5mm, NEXLEV
Tech specs    

Official Product Page

    71764-0018

Molex Electronics Ltd.
Part No. 71764-0018
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, Tin (Sn) Plating

File Size 120.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 77311-802-20LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    71764-0020

Molex Electronics Ltd.
Part No. 71764-0020
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, Tin (Sn) Plating

File Size 121.14K  /  5 Page

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Amphenol Communications Solutions

Part No. 51940-220LF
Description PwrBlade®, Power Supply Connectors, 12P 24S Vertical Receptacle.
Tech specs    

Official Product Page

For 71764-0220 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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