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  2462 Datasheet PDF File

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    SHD224622

Sensitron
Part No. SHD224622
Description HERMETIC POWER MOSFET N-CHANNEL

File Size 57.99K  /  3 Page

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Amphenol Communications Solutions

Part No. 87052-462HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    TOSHIBA[Toshiba Semiconductor]
Part No. 2SD2462 E001189
Description NPN TRIPLE DIFFUSED TYPE (POWER AMPLIFIER APPLICATIONS)
From old datasheet system

File Size 190.27K  /  3 Page

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Amphenol Communications Solutions

Part No. 87024-625CTLF
Description Rib-Cage® Board-To-Board, Surface Mount PCB Receptacle, 50 Positions, Locator Mounting style.
Tech specs    

Official Product Page

    70246-2602 0702462602

Molex Electronics Ltd.
Part No. 70246-2602 0702462602
Description 2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 175.78K  /  4 Page

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Amphenol Communications Solutions

Part No. 87024-620TRLF
Description Rib-Cage® Board-To-Board, Surface Mount PCB Receptacle, 40 Positions, Locator Mounting style.
Tech specs    

Official Product Page

    70246-2402 0702462402

Molex Electronics Ltd.
Part No. 70246-2402 0702462402
Description 2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 24Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100") Pitch C-Grid垄莽 Header, Low Profile, Dual Row, Vertical, Shrouded, 24Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plati

File Size 175.94K  /  4 Page

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Amphenol Communications Solutions

Part No. 77313-824-62LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 62 Positions
Tech specs    

Official Product Page

    0702462001 70246-2001

Molex Electronics Ltd.
Part No. 0702462001 70246-2001
Description 2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 175.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 77313-424-62LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 62 Positions
Tech specs    

Official Product Page

    0702462002 70246-2002

Molex Electronics Ltd.
Part No. 0702462002 70246-2002
Description 2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 175.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 68492-462HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0702462004 70246-2004

Molex Electronics Ltd.
Part No. 0702462004 70246-2004
Description 2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 20Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 20Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC Tail Plating

File Size 176.00K  /  4 Page

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Amphenol Communications Solutions

Part No. 68602-462HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    70246-2604 0702462604

Molex Electronics Ltd.
Part No. 70246-2604 0702462604
Description 2.54mm (.100) Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.127渭m (5渭) Gold (Au) Plating, Tin(Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC Tail Plating

File Size 176.00K  /  4 Page

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Amphenol Communications Solutions

Part No. 87024-625TRLF
Description Rib-Cage® Board-To-Board, PCB Mounted Receptacle, Vertical, Surface Mount, Polarized, 50 Positions, 1.27mm (0.05in) Pitch.
Tech specs    

Official Product Page

    70246-2601 0702462601

Molex Electronics Ltd.
Part No. 70246-2601 0702462601
Description 2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 175.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 10123246-22000LF
Description HPCE CTB R/A HEADER 6LP with latch assembly
Tech specs    

Official Product Page

    70246-2501 0702462501

Molex Electronics Ltd.
Part No. 70246-2501 0702462501
Description 2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded,26 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating,
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded,26 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, Void

File Size 175.78K  /  4 Page

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Amphenol Communications Solutions

Part No. 68692-462HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

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