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Amphenol Communications Solutions |
| Part No. |
77311-846-16LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-4616-21H
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 2.25mm Wipe, APP.
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Official Product Page
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AMPHENOL CORP
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| Part No. |
10-194636-52N 10-194620-27J 10-194616-10L 10-194632-7I 10-194618-8G
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| Description |
52 CONTACT(S), ALUMINUM ALLOY, FEMALE, MIL SERIES CONNECTOR, SOLDER, PLUG
14 CONTACT(S), ALUMINUM ALLOY, FEMALE, MIL SERIES CONNECTOR, SOLDER, PLUG
3 CONTACT(S), ALUMINUM ALLOY, FEMALE, MIL SERIES CONNECTOR, SOLDER, PLUG
35 CONTACT(S), ALUMINUM ALLOY, MALE, MIL SERIES CONNECTOR, SOLDER, PLUG
8 CONTACT(S), ALUMINUM ALLOY, MALE, MIL SERIES CONNECTOR, SOLDER, PLUG
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| File Size |
169.16K /
1 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
77311-146-16LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0702461602 70246-1602
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
175.78K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77313-846-16LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 16 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-4616-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-4616-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10132446-16LF
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| Description |
Minitek® Pwr 3.0 HCC, Plug Housing, 16 Positions, Black Color, GW Compatible.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-4616-21D
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0702461601 70246-1601
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
175.77K /
4 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
DWRT200PM14616
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| Description |
COOLPOWER MEZZANINE
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877584616 87758-4616
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| Description |
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.71K /
4 Page |
View
it Online |
Download Datasheet |
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Texas Instruments |
| Part No. |
MSP430F4616IPZ
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| Description |
16-Bit Ultra-Low-Power MCU, 92KB Flash, 4KB RAM, 12-Bit ADC, DMA, 160 Seg LCD 100-LQFP -40 to 85
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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