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  85015-9004 Datasheet PDF File

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    0850150335 85015-0335

Molex Electronics Ltd.
Part No. 0850150335 85015-0335
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Press-fit Style R, 1楼矛m (40楼矛) Gold (Au), 128 Circuit
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Press-fit Style R, 1μm (40μ) Gold (Au), 128 Circuit

File Size 63.95K  /  3 Page

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Amphenol Communications Solutions

Part No. 10110818-5015LF
Description SFP+ Cable Assembly, 24 AWG, 1.5 meters, passive -standard raw cable, non-halogen free.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0850150218 85015-0218

Molex Electronics Ltd.
Part No. 0850150218 85015-0218
Description 2.54mm (.100) Pitch DIN 41612 Header, 4-Row C-Pin, Press-Fit Style R Reverse

File Size 67.24K  /  3 Page

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Amphenol Communications Solutions

Part No. 10110818-5015HFLF
Description SFP+ Cable Assembly, 24 AWG, 1.5 meters, passive -standard raw cable, halogen free.
Tech specs    

Official Product Page

    85015-9006 0850159006

Molex Electronics Ltd.
Part No. 85015-9006 0850159006
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Press-fit Style R , 0.6渭m (24渭) Selective Gold (Au), 128 Circuits, Lead Free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Press-fit Style R , 0.6μm (24μ) Selective Gold (Au), 128 Circuits, Lead Free

File Size 75.18K  /  3 Page

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Amphenol Communications Solutions

Part No. 95278-501-50LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 50 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    85015-0024 0850150024

Molex Electronics Ltd.
Part No. 85015-0024 0850150024
Description 2.54mm (.100) Pitch DIN 41612 Header, 4-Row C-Pin, Press-Fit Style R Reverse, 0.6μm (24μ) Selective Gold (Au), 128 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, 4-Row C-Pin, Press-Fit Style R Reverse, 0.6楼矛m (24楼矛) Selective Gold (Au), 128 Circuits, Lead free

File Size 67.71K  /  3 Page

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Amphenol Communications Solutions

Part No. 10115859-004LF
Description HPCE R/A REC 36P24S
Tech specs    

Official Product Page

    8337-9000 8337-9003 8337-9004 8315-9003 8315-9000 8315-9004

3M Electronics
Part No. 8337-9000 8337-9003 8337-9004 8315-9003 8315-9000 8315-9004
Description D Sub

File Size 38.86K  /  3 Page

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Amphenol Communications Solutions

Part No. 91269-004LF
Description Minitek® 2.00mm, Board to Board, Shrouded Header - Through Hole - Single row - 4 Positions - 2mm (0.079in) - Right Angle.
Tech specs    

Official Product Page

    TML9004

Spectrum Microwave, Inc.
Part No. TML9004
Description RF Limiting Amplifier

File Size 604.58K  /  1 Page

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Amphenol Communications Solutions

Part No. 87900-414HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    API Technologies Corp
Part No. TML9004
Description    RF Limiting Amplifier Power Output (1 dB Comp.): 11 dBm

File Size 604.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 87900-434HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    C900406 C9004

Hamamatsu Corporation
Part No. C900406 C9004
Description Driver circuit for 16-element photodiode array

File Size 75.63K  /  2 Page

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Amphenol Communications Solutions

Part No. 87900-454HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 54 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    HXJ
Part No. HXJ9004
Description HXJ9004

File Size 464.68K  /  6 Page

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Amphenol Communications Solutions

Part No. 87900-402HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 2 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    MSM9004 MSM9004-04 MSM9004-03 MSM9004_03_04

OKI SEMICONDUCTOR CO., LTD.
OKI electronic componets
OKI electronic components
Part No. MSM9004 MSM9004-04 MSM9004-03 MSM9004_03_04
Description From old datasheet system
1/4 DUTY LCD DRIVER WITH 4-DOT COMMON DRIVER AND 50-DOT SEGMENT DRIVER

File Size 112.86K  /  15 Page

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Amphenol Communications Solutions

Part No. 87900-422HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

For 85015-9004 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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