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  85015-9004 Datasheet PDF File

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    85015-9004

Molex Electronics Ltd.
Part No. 85015-9004
Description 2.54mm (.100) Pitch DIN 41612 Header, 4-Row, Style R, Through Hole, Press-fit, Male, 0.6渭m (24渭) Selective Gold (Au), First-Mate-Last-BreakPins, 128 Circuits
2.54mm (.100) Pitch DIN 41612 Header, 4-Row, Style R, Through Hole, Press-fit, Male, 0.6μm (24μ) Selective Gold (Au), First-Mate-Last-BreakPins, 128 Circuits

File Size 141.56K  /  4 Page

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Amphenol Communications Solutions

Part No. 10110818-5015LF
Description SFP+ Cable Assembly, 24 AWG, 1.5 meters, passive -standard raw cable, non-halogen free.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Samsung Electronic
Part No. S3C9004/P9004/C9014/P9014
Description Single-chip 8-bit Microcontroller Instruction Set

File Size 303.02K  /  63 Page

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Amphenol Communications Solutions

Part No. 10110818-5015HFLF
Description SFP+ Cable Assembly, 24 AWG, 1.5 meters, passive -standard raw cable, halogen free.
Tech specs    

Official Product Page

    ST Microelectronics
Part No. DB-85015-940
Description RF power amplifier using 1 x PD85015-E N-channel enhancement-mode lateral MOSFETs

File Size 505.71K  /  14 Page

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Amphenol Communications Solutions

Part No. 95278-501-50LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 50 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    85015-0165

Molex Electronics Ltd.
Part No. 85015-0165
Description 2.54mm (.100) Pitch DIN 41612 Header, 4-Row C-Pin, Press-Fit Style R Reverse, Vertical, Through Hole

File Size 67.40K  /  3 Page

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Amphenol Communications Solutions

Part No. 10115859-004LF
Description HPCE R/A REC 36P24S
Tech specs    

Official Product Page

    Molex, Inc.
Part No. 85015-0036
Description DINCONN.R MALE PF 128CKT 850150036 128 CONTACT(S), MALE, STRAIGHT TWO PART EURO CONNECTOR, PRESS FIT

File Size 56.72K  /  1 Page

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Amphenol Communications Solutions

Part No. 91269-004LF
Description Minitek® 2.00mm, Board to Board, Shrouded Header - Through Hole - Single row - 4 Positions - 2mm (0.079in) - Right Angle.
Tech specs    

Official Product Page

    85015-0206

Molex Electronics Ltd.
Part No. 85015-0206
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, 4-Row, Style R Male

File Size 61.92K  /  3 Page

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Amphenol Communications Solutions

Part No. 87900-414HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    85015-9005

Molex Electronics Ltd.
Part No. 85015-9005
Description 2.54mm (.100") Pitch DIN 41612 Header, 4-Row Through Hole, Press-fit, Vertical, Style R
2.54mm (.100) Pitch DIN 41612 Header, 4-Row Through Hole, Press-fit, Vertical, Style R

File Size 183.52K  /  5 Page

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Amphenol Communications Solutions

Part No. 87900-434HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    85015-9008

Molex Electronics Ltd.
Part No. 85015-9008
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Press-fit Style R, 0.6渭m (24渭) Selective Gold (Au), 128 Circuits, Lead Free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Press-fit Style R, 0.6μm (24μ) Selective Gold (Au), 128 Circuits, Lead Free

File Size 167.63K  /  5 Page

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Amphenol Communications Solutions

Part No. 87900-454HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 54 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    85015-0311

Molex Electronics Ltd.
Part No. 85015-0311
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Press-fit Style R, 0.6μm (24μ) Gold (Au), 128 Circuit, Lead Free

File Size 72.04K  /  3 Page

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Amphenol Communications Solutions

Part No. 87900-402HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 2 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    85015-0141

Molex Electronics Ltd.
Part No. 85015-0141
Description 2.54mm (.100) Pitch DIN 41612 Header, 4-Row C-Pin, Press-Fit Style R Reverse, Vertical, Through Hole, 0.6μm (24μ) Gold (Au), 128 Circuits, Lead free

File Size 69.39K  /  3 Page

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Amphenol Communications Solutions

Part No. 87900-422HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

For 85015-9004 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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