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  71764-0114 Datasheet PDF File

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    0717640212 71764-0212

Molex Electronics Ltd.
Part No. 0717640212 71764-0212
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    71764-0016 0717640016

Molex Electronics Ltd.
Part No. 71764-0016 0717640016
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, Tin (Sn) Plating

File Size 121.06K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    71764-0028 0717640028

Molex Electronics Ltd.
Part No. 71764-0028 0717640028
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 28 Circuits, Tin (Sn) Plating

File Size 120.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    0717640210 71764-0210

Molex Electronics Ltd.
Part No. 0717640210 71764-0210
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 121.17K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    0717640208 71764-0208

Molex Electronics Ltd.
Part No. 0717640208 71764-0208
Description 2.54mm (.100") Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 8 Circuits
2.54mm (.100) Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 8 Circuits

File Size 120.93K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114508-D0J-20DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs    

Official Product Page

    0717640206 71764-0206

Molex Electronics Ltd.
Part No. 0717640206 71764-0206
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 6 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.93K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114828-10102LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
Tech specs    

Official Product Page

    0717640204 71764-0204

Molex Electronics Ltd.
Part No. 0717640204 71764-0204
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.70K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114868-L0J-10DLF
Description XCede® High Speed Backplane Connectors, 3 wall left header.
Tech specs    

Official Product Page

    71764-0030 0717640030

Molex Electronics Ltd.
Part No. 71764-0030 0717640030
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right An

File Size 120.99K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114508-00J-20DLF
Description XCede® High Speed Backplane Connectors, 2 wall header.
Tech specs    

Official Product Page

    0717640112 71764-0112

Molex Electronics Ltd.
Part No. 0717640112 71764-0112
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 12 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
MOLEX Connector

File Size 121.09K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114492-008LF
Description HPCE R/A REC 32P24S
Tech specs    

Official Product Page

    71764-0014 0717640014

Molex Electronics Ltd.
Part No. 71764-0014 0717640014
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 14 Circuits, Tin (Sn) Plating

File Size 121.06K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114868-10J-10DLF
Description XCede® High Speed Backplane Connectors, 4 wall header.
Tech specs    

Official Product Page

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