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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
XPH13016MC
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| Description |
P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF)
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
63444-001TC
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| Description |
Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 50 Positions, 2.00mm (0.079in) Pitch..
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
63444-006TCLF
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| Description |
Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 16 Positions, 2.00mm (0.079in) Pitch..
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
63444-006TC
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| Description |
Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 16 Positions, 2.00mm (0.079in) Pitch..
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
63444-003TCLF
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| Description |
Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 16 Positions, 2.00mm (0.079in) Pitch..
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
92634-448HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 48 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
92634-446HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 46 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
14-44-2907 A-70475-1301
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| Description |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.76μm (30μ) Gold (Au), 7 Circuits 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.76μm (30μ) Gold (Au), 7 Circuits
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| File Size |
141.38K /
2 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
92634-444HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 44 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
92634-440HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 40 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
92634-442HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 42 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
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| Tech specs |
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Official Product Page
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Bom2Buy.com

Price and Availability
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