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  63444-1301 Datasheet PDF File

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    63444-1301

Molex Electronics Ltd.
Part No. 63444-1301
Description Conductor Punch

File Size 26.88K  /  1 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. XPH13016MC
Description P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF)
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    TPZ-1301/M4G/HDD320G

List of Unclassifed Manufacturers
Part No. TPZ-1301/M4G/HDD320G
Description Intel? Atom D2550/ N2600 Intelligent Health Care Platform with Rich I/O

File Size 167.17K  /  3 Page

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Amphenol Communications Solutions

Part No. 63444-001TC
Description Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 50 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    63444-1009

Molex Electronics Ltd.
Part No. 63444-1009
Description Punch

File Size 26.24K  /  1 Page

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Amphenol Communications Solutions

Part No. 63444-006TCLF
Description Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 16 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    63444-1909

Molex Electronics Ltd.
Part No. 63444-1909
Description Punch

File Size 25.09K  /  1 Page

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Amphenol Communications Solutions

Part No. 63444-006TC
Description Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 16 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    63444-1605

Molex Electronics Ltd.
Part No. 63444-1605
Description Punch

File Size 25.09K  /  1 Page

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Amphenol Communications Solutions

Part No. 63444-003TCLF
Description Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 16 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    63444-1210

Molex Electronics Ltd.
Part No. 63444-1210
Description Punch

File Size 25.09K  /  1 Page

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Amphenol Communications Solutions

Part No. 92634-448HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 48 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs    

Official Product Page

    63444-1405

Molex Electronics Ltd.
Part No. 63444-1405
Description Punch

File Size 26.31K  /  1 Page

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Amphenol Communications Solutions

Part No. 92634-446HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 46 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs    

Official Product Page

    63444-1018

Molex Electronics Ltd.
Part No. 63444-1018
Description Punch

File Size 25.02K  /  1 Page

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Amphenol Communications Solutions

Part No. 92634-444HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 44 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs    

Official Product Page

    63444-0705

Molex Electronics Ltd.
Part No. 63444-0705
Description Punch

File Size 26.24K  /  1 Page

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Amphenol Communications Solutions

Part No. 92634-440HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 40 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs    

Official Product Page

    63444-1006

Molex Electronics Ltd.
Part No. 63444-1006
Description Punch

File Size 27.93K  /  1 Page

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Amphenol Communications Solutions

Part No. 92634-442HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 42 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs    

Official Product Page

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