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  clad Datasheet PDF File

For clad Found Datasheets File :: 4253    Search Time::1.235ms    
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    BAL99LT1-D

ON Semiconductor
Part No. BAL99LT1-D
OCR Text ...inum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher ...
Description Switching Diode

File Size 43.13K  /  4 Page

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    BAS116LT1-D

ON Semiconductor
Part No. BAS116LT1-D
OCR Text ...inum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher t...
Description Switching Diode

File Size 36.92K  /  4 Page

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    BAS16LT1-D

ON Semiconductor
Part No. BAS16LT1-D
OCR Text ...inum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher ...
Description Switching Diode

File Size 46.91K  /  4 Page

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    BAS16TT1-D

ON Semiconductor
Part No. BAS16TT1-D
OCR Text ...num core board such as thermal clad ? . using a board material such as thermal clad, a higher power dissipation can be achieved using the same footprint. interface between the board and the package. with the correct pad geometry, the packa...
Description Silicon Switching Diode

File Size 76.16K  /  8 Page

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    BAS16WT1-D

ON Semiconductor
Part No. BAS16WT1-D
OCR Text ...inum core board such as thermal clad ? . using a board material such as thermal clad, a power dissipation of 300 milliwatts can be achieved using the same footprint. soldering precautions the melting temperature of solder is higher than the...
Description Silicon Switching Diode

File Size 63.83K  /  8 Page

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    BAS19LT1-D

ON Semiconductor
Part No. BAS19LT1-D
OCR Text ...inum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher t...
Description High Voltage Switching Diode

File Size 45.16K  /  4 Page

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    BAS21SLT1-D

ON Semiconductor
Part No. BAS21SLT1-D
OCR Text ...inum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher ...
Description Dual Series High Voltage Switching Diode

File Size 46.29K  /  4 Page

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    BAS70-04LT1-D

ON Semiconductor
Part No. BAS70-04LT1-D
OCR Text ...inum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher t...
Description Dual Series Schottky Barrier Diode

File Size 40.40K  /  4 Page

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    BAT54ALT1-D

ON Semiconductor
Part No. BAT54ALT1-D
OCR Text ...inum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher ...
Description Schottky Barrier Diodes

File Size 52.10K  /  8 Page

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    BAT54LT1-D

ON Semiconductor
Part No. BAT54LT1-D
OCR Text ...inum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher t...
Description Schottky Barrier Diodes

File Size 52.16K  /  8 Page

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For clad Found Datasheets File :: 4253    Search Time::1.235ms    
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