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  clad Datasheet PDF File

For clad Found Datasheets File :: 4253    Search Time::3.969ms    
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    Conexant Systems, Inc.
Part No. BT8370 BT8375 BT8376 BT8375KPF
OCR Text ... Dual-Rail/NRZ/ External DL3 clad I/O Data Sheet N8370DSE June 30, 1999 Bt8370EVM--Bt8370 Evaluation Module, Quad T1/E1 ISDN PRI Board T1 or E1 connection at DSX or CSU levels Address Bus MC68302 Microprocessor 9 Data Bus 8...
Description single chip transceivers for T1/E1 and Integrated Service Digital Network (ISDN) primary rate interfaces
Fully Integrated T1/E1 Framer and Line Interface

File Size 1,918.78K  /  323 Page

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    MMBD1010LT1-D

ON Semiconductor
Part No. MMBD1010LT1-D
OCR Text ...emark of motorola, inc. thermal clad is a registered trademark of the berquist company. order this document by mmbd1010lt1/d semiconductor technical data 3 cathode anode 1 2 anode case 318-08, styl...
Description Switching Diode

File Size 117.51K  /  8 Page

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    MMBTH10LT1-D

ON Semiconductor
Part No. MMBTH10LT1-D
OCR Text ...inum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher ...
Description VHF/UHF Transistor NPN Silicon

File Size 55.86K  /  8 Page

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    BAV199LT1-D BAV199LT1/D

东电?中国)投资有限公司
ON Semiconductor
Part No. BAV199LT1-D BAV199LT1/D
OCR Text ...inum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher t...
Description Dual Series Switching Diode 双系列开关二极管

File Size 39.23K  /  4 Page

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    2SA1774-D

ON Semiconductor
Part No. 2SA1774-D
OCR Text ...inum core board such as thermal clad ? . using a board material such as thermal clad, a higher power dissipation can be achieved using the same footprint. interface between the board and the package. with the correct pad geometry, the packa...
Description PNP Silicon General Purpose Amplifier Transistor

File Size 51.12K  /  8 Page

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    NCP1010 NCP1012 NCP1011

ON Semiconductor
Part No. NCP1010 NCP1012 NCP1011
OCR Text ...70 m) printed circuit copper clad ??0.36 sq. inch (2.32 sq. cm) ??1.0 sq. inch (6.45 sq. cm) pl suffix (gull wing), case 626aa ?junction-to-lead ?junction-to-air, 2.0 oz (70 m) printed circuit copper clad ??0.36 sq. inch (2.32 sq. cm)...
Description Self-Supplied Monolithic Switcher for Low Standby-Power Offline SMPS(自身供电的单片转换开关,用于待机功耗低的离线开关方式电

File Size 448.10K  /  24 Page

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    BAS40-04LT1-D

ON Semiconductor
Part No. BAS40-04LT1-D
OCR Text ...inum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher ...
Description Dual Series Schottky Barrier Diode

File Size 44.99K  /  4 Page

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    BAS40-06LT1-D

ON Semiconductor
Part No. BAS40-06LT1-D
OCR Text ...inum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher t...
Description Common Anode Schottky Barrier Diodes

File Size 41.00K  /  4 Page

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    BC807-16LT1-D

ON Semiconductor
Part No. BC807-16LT1-D
OCR Text ...inum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher ...
Description General Purpose Transistors PNP Silicon

File Size 63.33K  /  8 Page

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