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IDTQS32 15SMC56A CMHZ4122 G1047 L1131C A019605 CX162 SGP30N60
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  85013-3122 Datasheet PDF File

For 85013-3122 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0850132282 85013-2282

Molex Electronics Ltd.
Part No. 0850132282 85013-2282
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, C-Pin Press-Fit Style R Reverse, 1μm (40μ) Selective Gold (Au), 64 Circuits, Lead free

File Size 193.59K  /  5 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TLP3122A
Description Photorelay (MOSFET output, 1-form-a), 60 V/1.4 A, 3750 Vrms, 4pin SO6
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0850131768 85013-1768

Molex Electronics Ltd.
Part No. 0850131768 85013-1768
Description 2.54mm (.100) Pitch DIN 41612 Header, Style R/2 Reverse, 1μm (40μ) Selective Gold (Au) ,48 Circuits

File Size 112.87K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-501-38LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    85013-1108 0850131108

Molex Electronics Ltd.
Part No. 85013-1108 0850131108
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, Style R Reverse, 0.6um (24u) Selective Gold (Au)

File Size 130.64K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-501-36LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0850130385 85013-0385

Molex Electronics Ltd.
Part No. 0850130385 85013-0385
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, C-Pin Press-Fit Style R/2 Reverse

File Size 311.07K  /  6 Page

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Amphenol Communications Solutions

Part No. 95278-501-30LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0850130438 85013-0438

Molex Electronics Ltd.
Part No. 0850130438 85013-0438
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, Style R Reverse, 1μm (40μ) Selective Gold (Au), 96 Circuits, Lead free

File Size 128.65K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-501-34LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0850132828 85013-2828

Molex Electronics Ltd.
Part No. 0850132828 85013-2828
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, 3-Row C-Pin, Press-Fit Style R Male

File Size 215.91K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-501-32LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0850132012 85013-2012

Molex Electronics Ltd.
Part No. 0850132012 85013-2012
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse1μm (40μ) Selective Gold (Au), 48 Circuits, Lead free
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse1渭m (40渭") Selective Gold (Au), 48 Circuits, Lead free

File Size 267.35K  /  8 Page

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Amphenol Communications Solutions

Part No. 10137785-031222LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Black Color, 3 Positions, Non GW Compatible, without Post, Tray packing.
Tech specs    

Official Product Page

    0850130103

Molex Electronics Ltd.
Part No. 0850130103
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, C-Pin Press-Fit Style R Reverse, 0.6μm (24μ) Selective Gold (Au), 64 Circuits, Lead free

File Size 81.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 10131931-221ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 21 Positions, 2mm (0.079inch), horizontal.
Tech specs    

Official Product Page

    0850132127 85013-2127

Molex Electronics Ltd.
Part No. 0850132127 85013-2127
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse, 1μm (40μ) Selective Gold (Au), 48 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse, 1楼矛m (40楼矛) Selective Gold (Au), 48 Circuits, Lead free

File Size 159.01K  /  6 Page

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Amphenol Communications Solutions

Part No. G832MB010403122HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 5.7 mm, 40 Positions, Dual Row, BTB Vertical Receptacle SMT, 15u\\ Gold Black.
Tech specs    

Official Product Page

    0850130024 85013-0024

Molex Electronics Ltd.
Part No. 0850130024 85013-0024
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 0.6μm (24μ) Selective Gold (Au), 96 Circuits
MOLEX Connector

File Size 135.50K  /  5 Page

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Amphenol Communications Solutions

Part No. 68033-122HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

For 85013-3122 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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