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Molex Electronics Ltd.
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| Part No. |
85013-3122 0850133122
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| Description |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1μm (40μ) Selective Gold (Au), 96 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1渭m (40渭) Selective Gold (Au), 96 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1楼矛m (40楼矛) Selective Gold (Au), 96 Circuits, Lead free
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| File Size |
128.70K /
5 Page |
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it Online |
Download Datasheet
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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TLP3122A
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| Description |
Photorelay (MOSFET output, 1-form-a), 60 V/1.4 A, 3750 Vrms, 4pin SO6
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-501-38LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-501-36LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-501-30LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
85013-3160
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| Description |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1μm (40μ) Selective Gold (Au), 32 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1楼矛m (40楼矛) Selective Gold (Au), 32 Circuits, Lead free
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| File Size |
124.34K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
95278-501-34LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-501-32LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10137785-031222LF
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| Description |
Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Black Color, 3 Positions, Non GW Compatible, without Post, Tray packing.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10131931-221ULF
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| Description |
Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 21 Positions, 2mm (0.079inch), horizontal.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
G832MB010403122HR
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| Description |
0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 5.7 mm, 40 Positions, Dual Row, BTB Vertical Receptacle SMT, 15u\\ Gold Black.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68033-122HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
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Official Product Page
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Price and Availability
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