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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TLP3122A
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| Description |
Photorelay (MOSFET output, 1-form-a), 60 V/1.4 A, 3750 Vrms, 4pin SO6
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-501-38LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-501-36LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-501-30LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-501-34LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-501-32LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
85013-3081 0850133081
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| Description |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0μm (39μ) Selective Gold (Au), 96 Circuits
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0渭m (39渭) Selective Gold (Au), 96 Circuits
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0楼矛m (39楼矛) Selective Gold (Au), 96 Circuits
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| File Size |
146.73K /
5 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10137785-031222LF
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| Description |
Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Black Color, 3 Positions, Non GW Compatible, without Post, Tray packing.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
85013-3093 0850133093
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| Description |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0μm (39μ)Selective Gold (Au), 96 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0渭m (39渭")Selective Gold (Au), 96 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0楼矛m (39楼矛")Selective Gold (Au), 96 Circuits
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| File Size |
146.04K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10131931-221ULF
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| Description |
Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 21 Positions, 2mm (0.079inch), horizontal.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
G832MB010403122HR
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| Description |
0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 5.7 mm, 40 Positions, Dual Row, BTB Vertical Receptacle SMT, 15u\\ Gold Black.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
85013-3196 0850133196
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| Description |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse, 1μm (40μ) Selective Gold (Au), 48 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse, 1渭m (40渭) Selective Gold (Au), 48 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse, 1楼矛m (40楼矛) Selective Gold (Au), 48 Circuits, Lead free
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| File Size |
161.37K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68033-122HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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