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  0780 Datasheet PDF File

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    53253-0780 0532530780

Molex Electronics Ltd.
Part No. 53253-0780 0532530780
Description 2.00mm (.079) Pitch Micro-Latch Wire-to-Board Header, Vertical, Square PinThree-sided Shroud, Lead-free, 7 Circuits, PC Tail Length 2.30mm (.091)

File Size 151.05K  /  4 Page

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Texas Instruments

Part No. 5962-9078003M3A
Description 8-Bit Bus-Interface Flip-Flops With 3-State Outputs 28-LCCC -55 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0780013344

Molex Electronics Ltd.
Part No. 0780013344
Description 0.60mm Pitch miniDIMM DDR3 Socket, Surface Mount, Reverse Right Angle

File Size 25.58K  /  2 Page

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Texas Instruments

Part No. M38510/07801BJA
Description Arithmetic Logic Units/Function Generators 24-CDIP -55 to 125
Tech specs    

Official Product Page

    0780350202

Molex Electronics Ltd.
Part No. 0780350202
Description 0.60mm Pitch miniDIMM DDR Socket, Surface Mount, 22.5 Reverse Angle

File Size 24.25K  /  2 Page

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Texas Instruments

Part No. 5962-9078001MLA
Description 10-Bit Bus Interface Flip-Flops With 3-State Outputs 24-CDIP -55 to 125
Tech specs    

Official Product Page

    0780011200

Molex Electronics Ltd.
Part No. 0780011200
Description 0.60mm Pitch miniDIMM Socket, Surface Mount, Reverse Right Angle

File Size 21.03K  /  2 Page

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Texas Instruments

Part No. M38510/07802BEA
Description Look-Ahead Carry Generators 16-CDIP -55 to 125
Tech specs    

Official Product Page

    78061-0001 0780610001

Molex Electronics Ltd.
Part No. 78061-0001 0780610001
Description 1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38渭m (15渭) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38μm (15μ) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins

File Size 361.88K  /  7 Page

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Texas Instruments

Part No. JM38510/07801BJA
Description Arithmetic Logic Units/Function Generators 24-CDIP -55 to 125
Tech specs    

Official Product Page

    0780790011 78079-0011

Molex Electronics Ltd.
Part No. 0780790011 78079-0011
Description 1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76渭m (30渭) Gold (Au) Plating
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76μm (30μ) Gold (Au) Plating

File Size 809.46K  /  10 Page

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Texas Instruments

Part No. JM38510/07802BEA
Description Look-Ahead Carry Generators 16-CDIP -55 to 125
Tech specs    

Official Product Page

    0780790012 78079-0012

Molex Electronics Ltd.
Part No. 0780790012 78079-0012
Description 1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76渭m (30渭) Gold (Au) Plating
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76μm (30μ) Gold (Au) Plating

File Size 809.46K  /  10 Page

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Renesas Electronics Corporation

Part No. AMB0780L4RJ
Description Advanced Memory Buffer Low Power for FB-DIMM Modules
Tech specs    

Official Product Page

    0780350301

Molex Electronics Ltd.
Part No. 0780350301
Description 0.60mm (.024) Pitch miniDIMM DDR3 Socket, Surface Mount, 22.5掳 Reverse Angle, 0.76渭m (30渭) Gold (Au) Plating, Off-White Latches, 244 Circuits,1.5V Voltage Key

File Size 479.88K  /  7 Page

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Renesas Electronics Corporation

Part No. AMB0780L4RJ8
Description Advanced Memory Buffer Low Power for FB-DIMM Modules
Tech specs    

Official Product Page

    0780350001 78035-0001

Molex Electronics Ltd.
Part No. 0780350001 78035-0001
Description 0.60mm (.024") Pitch miniDIMM DDR2 Socket, Surface Mount, 22.5掳 Reverse Angle,0.76渭m (30渭") Gold (Au) Plating, Off-White Latches, with Pick-and-Place Cap, 244
0.60mm (.024) Pitch miniDIMM DDR2 Socket, Surface Mount, 22.5° Reverse Angle,0.76μm (30μ) Gold (Au) Plating, Off-White Latches, with Pick-and-Place Cap, 244

File Size 477.35K  /  7 Page

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Amphenol Communications Solutions

Part No. HS30780081
Description Backplane connectors,cable backplane ,Paladin 4X8 Cable, 30 AWG, 25 GHz
Tech specs    

Official Product Page

    0780790052 78079-0052

Molex Electronics Ltd.
Part No. 0780790052 78079-0052
Description 1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing, Off-White Latches, 0.38渭m (15渭) Gold(Au) Plating
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing, Off-White Latches, 0.38μm (15μ) Gold(Au) Plating

File Size 809.49K  /  10 Page

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Amphenol Communications Solutions

Part No. 10007607-801-36LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled header ,Through Hole, Row Polarized ,Double row , 36 Positions ,2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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