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  08121 Datasheet PDF File

For 08121 Found Datasheets File :: 22+       Page :: | <1> | 2 | 3 |   

    SL0812101

AMETHERM Circuit Protection Thermistors
Part No. SL0812101
Description Inside Kinked Leads Use -A after Ametherm’s part # Outside Kinked Leads Not Available

File Size 26.29K  /  1 Page

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Amphenol Communications Solutions

Part No. 10131319-0812100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 8 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    5008121000

Molex Electronics Ltd.
Part No. 5008121000
Description 3.00mm (.118) Pitch Mini-HMC Crimp Housing, Male, 2 Rows, 10 Circuits

File Size 88.22K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-808121300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    41695-N-B12 0009508121 09-50-8121

Molex Electronics Ltd.
Part No. 41695-N-B12 0009508121 09-50-8121
Description 3.96mm (.156) Pitch KK? Crimp Terminal Housing, Friction Ramp, 12 Circuits
3.96mm (.156") Pitch KK庐 Crimp Terminal Housing, Friction Ramp, 12 Circuits
3.96mm (.156") Pitch KK垄莽 Crimp Terminal Housing, Friction Ramp, 12 Circuits

File Size 286.56K  /  3 Page

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Amphenol Communications Solutions

Part No. U90B2054081210
Description ExpressPort QSFP+, High Speed Input Output Connectors, QSFP STACKED COMBO.
Tech specs    

Official Product Page

    Hynix Semiconductor, Inc.
Part No. HY27SS08121M-FCP HY27SS08121M-FPCP
Description 64M X 8 FLASH 1.8V PROM, 12000 ns, PBGA63 8.50 X 15 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, FBGA-63
64M X 8 FLASH 1.8V PROM, 12000 ns, PBGA63 8.50 X 15 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-63

File Size 682.47K  /  45 Page

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Amphenol Communications Solutions

Part No. 10131319-08121G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 8 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    M26UX-008260A M26US-008261A M26US-008262A M26US-008263A M26US-008123A M26US-008121A M26US-008122A M26UX-008120A

Superworld Electronics
Part No. M26UX-008260A M26US-008261A M26US-008262A M26US-008263A M26US-008123A M26US-008121A M26US-008122A M26UX-008120A
Description INTEGRATED MODULAR JACK

File Size 183.72K  /  3 Page

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Amphenol Communications Solutions

Part No. 54242-108121250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    HYNIX SEMICONDUCTOR INC
Part No. HY27US08121B-TIS HY27US16121B-TIP HY27US08121B-FPCB
Description 64M X 8 FLASH 3.3V PROM, 18 ns, PDSO48
32M X 16 FLASH 3.3V PROM, 18 ns, PDSO48
64M X 8 FLASH 3.3V PROM, 18 ns, PBGA63

File Size 368.68K  /  40 Page

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Amphenol Communications Solutions

Part No. G87MP081212C1HR
Description Mini power plus, Vertical, Dual row, 4.2mm pitch, 8 positions , 100u\\ Tin, 3.50mm tail length, 1 post, LCP, Natural , TRAY
Tech specs    

Official Product Page

    HY27SS08121M HY27US16121M Y27US08121M

Hynix Semiconductor
Part No. HY27SS08121M HY27US16121M Y27US08121M
Description Search --To HY27US081M
(HY27xSxx121M) 512Mbit (64Mx8bit / 32Mx16bit) NAND Flash

File Size 799.86K  /  43 Page

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Amphenol Communications Solutions

Part No. 54242-108121200LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    M22DS-008111A M22DS-008112A M22DS-008113A M22DS-008122A M22DS-008123A M22DS-008261A M22DS-008262A M22DS-008263A M22DS-00

Superworld Electronics
Part No. M22DS-008111A M22DS-008112A M22DS-008113A M22DS-008122A M22DS-008123A M22DS-008261A M22DS-008262A M22DS-008263A M22DS-008121A M22DX-008260A M22DX-008110A M22DX-008120A
Description INTEGRATED MODULAR JACK

File Size 190.24K  /  3 Page

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Amphenol Communications Solutions

Part No. 54242-808121350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    HY27US08121A HY27US16121A HY27SS08121A HY27SS16121A HY27SS08121A-TCP HY27SS08121A-TPCP HY27SS08121A-FPCP HY27SS08121A-SM

Hynix Semiconductor, Inc.
HYNIX SEMICONDUCTOR INC
Part No. HY27US08121A HY27US16121A HY27SS08121A HY27SS16121A HY27SS08121A-TCP HY27SS08121A-TPCP HY27SS08121A-FPCP HY27SS08121A-SMP HY27SS08121A-FCP HY27SS16121A-FCP HY27SS08121A-SPCP HY27SS16121A-FPCP HY27SS16121A-SMP HY27SS16121A-SCP HY27SS16121A-FEB HY27US08121A-FES
Description 512Mbit (64Mx8bit / 32Mx16bit) NAND Flash
64M X 8 FLASH 1.8V PROM, 40 ns, PDSO48 12 X 20 MM, 1.20 MM HEIGHT, TSOP1-48
64M X 8 FLASH 1.8V PROM, 40 ns, PDSO48 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48
64M X 8 FLASH 1.8V PROM, 40 ns, PBGA63 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-63
64M X 8 FLASH 1.8V PROM, 40 ns, PDSO48 12 X 17 MM, 0.65 MM HEIGHT, USOP1-48
64M X 8 FLASH 1.8V PROM, 40 ns, PBGA63 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, FBGA-63
32M X 16 FLASH 1.8V PROM, 40 ns, PBGA63 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, FBGA-63
64M X 8 FLASH 1.8V PROM, 40 ns, PDSO48 12 X 17 MM, 0.65 MM HEIGHT, LEAD FREE, USOP1-48
32M X 16 FLASH 1.8V PROM, 40 ns, PBGA63 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-63
32M X 16 FLASH 1.8V PROM, 40 ns, PDSO48 12 X 17 MM, 0.65 MM HEIGHT, USOP1-48
64M X 8 FLASH 3.3V PROM, 30 ns, PBGA63

File Size 421.19K  /  49 Page

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Amphenol Communications Solutions

Part No. 54122-108121300LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 12 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    HY27USXXX HY27SS16121M HY27SSXXX HY27US08121M HY27US16121M HY27SS08121M

Hynix Semiconductor Inc.
Hynix Semiconductor, Inc.
Part No. HY27USXXX HY27SS16121M HY27SSXXX HY27US08121M HY27US16121M HY27SS08121M
Description (HY27SSxxx) 512Mbit (64Mx8bit / 32Mx16bit) NAND Flash
512Mbit (64Mx8bit / 32Mx16bit) NAND Flash 512兆(64Mx8bit / 32Mx16bit)NAND闪存

File Size 731.68K  /  43 Page

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Amphenol Communications Solutions

Part No. 68020-812-145032LF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 08121 Found Datasheets File :: 22+       Page :: | <1> | 2 | 3 |   

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