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  106415-2050 Datasheet PDF File

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    106415-2050

Molex Electronics Ltd.
Part No. 106415-2050
Description iPASS High Density AOC Assembly (iPass-to-iPass), Multimode, 50/125m, Cable Diameter 3.00mm, Cable Length 50.00m
File Size 43.45K  /  1 Page

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Amphenol Communications Solutions
Part No. 10118615-205004LF
Description BergStik®, Board to Board connector, Unshrouded vertical header ,Through Hole ,Single row , 5 Positions ,2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    106415-2020

Molex Electronics Ltd.
Part No. 106415-2020
Description iPASS High Density AOC Assembly (iPass to-iPass), Multimode, 50/125m, Cable Diameter 3.00mm, Cable Length 20.00m
File Size 43.44K  /  1 Page

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Amphenol Communications Solutions
Part No. 59202-F32-05-084LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 10 Positions.
Tech specs 　 　

Official Product Page

    106415-2007

Molex Electronics Ltd.
Part No. 106415-2007
Description iPASS High Density AOC Assembly (iPass-to-iPass), Multimode, 50/125m, Cable Diameter 3.00mm, Cable Length 7.00m
File Size 43.44K  /  1 Page

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Amphenol Communications Solutions
Part No. 59202-T22-05-044LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 10 Positions.
Tech specs 　 　

Official Product Page

    106415-2010

Molex Electronics Ltd.
Part No. 106415-2010
Description iPASS High Density AOC Assembly (iPass to-iPass), Multimode, 50/125m, Cable Diameter 3.00mm, Cable Length 10.00m
File Size 43.44K  /  1 Page

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Amphenol Communications Solutions
Part No. 54111-409082050LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    106415-2015

Molex Electronics Ltd.
Part No. 106415-2015
Description iPASS High Density AOC Assembly (iPass-to-iPass), Multimode, 50/125m, Cable Diameter 3.00mm, Cable Length 15.00m
File Size 43.41K  /  1 Page

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Amphenol Communications Solutions
Part No. 20021832-05060C4LF
Description Minitek127®, Board to Board Stacking Header , Surface Mount, Double Row, 60 positions, 1.27mm (0.500in) pitch.
Tech specs 　 　

Official Product Page

    106415-2005

Molex Electronics Ltd.
Part No. 106415-2005
Description iPASS High Density AOC Assembly (iPass-to-iPass), Multimode, 50/125m, Cable Diameter 3.00mm, Cable Length 5.00m
File Size 43.41K  /  1 Page

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Amphenol Communications Solutions
Part No. G832ME131205022HR
Description Pitch 0.8mm, Height 7.7 mm, 120 Positions, Dual Row, BTB Vertical Plug SMT, Gold Flash White
Tech specs 　 　

Official Product Page

    106415-2025

Molex Electronics Ltd.
Part No. 106415-2025
Description iPASS High Density AOC Assembly (iPass to-iPass), Multimode, 50/125m, Cable Diameter 3.00mm, Cable Length 25.00m
File Size 43.45K  /  1 Page

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Amphenol Communications Solutions
Part No. G832MC111205022HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 7.7 mm, 120 Positions, Dual Row, BTB Vertical Plug SMT, Gold Flash Black.
Tech specs 　 　

Official Product Page

    Holtek Semiconductor Inc.
HOLTEK[Holtek Semiconductor Inc]
Part No. HT-2050
Description FIVE LAMP/LED FLASH DRIVER
File Size 231.08K  /  5 Page

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Amphenol Communications Solutions
Part No. 74978-102050LF
Description Metral® High Speed 2000 Series, Backplane Connectors, Header, Vertical Signal, 8 Row, Press-Fit, 96 Position, Select Load, Extended
Tech specs 　 　

Official Product Page

   
Part No. GF-2050
Description 250 V, 50 HZ, SINGLE PHASE EMI FILTER
File Size 53.52K  /  1 Page

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Amphenol Communications Solutions
Part No. 10118615-205005LF
Description BergStik®, Board to Board connector, Unshrouded vertical header ,Through Hole ,Single row , 5 Positions ,2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    PNP-2050-L22-G

RF Micro Devices
Part No. PNP-2050-L22-G
Description PLUG-N-PLAY NARROWBAND SYNTHESIZER
File Size 308.87K  /  3 Page

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Amphenol Communications Solutions
Part No. 54242-110362050LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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