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  1140-2045 Datasheet PDF File

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    11-40-2045 1140-2045 0011-40-2045

Molex Electronics Ltd.
Part No. 11-40-2045 1140-2045 0011-40-2045
Description Terminator Die - OVERLAP INSULATION CRIMP

File Size 19.49K  /  1 Page

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Amphenol Communications Solutions

Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    3M Company
Part No. CFAK12P1140/KS35L
Description PROXIMITY SENSOR-CAPACITIVE, 200mA, CYLINDRICAL

File Size 91.38K  /  1 Page

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Amphenol Communications Solutions

Part No. 68020-458HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 58 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    39-30-2045

Molex Electronics Ltd.
Part No. 39-30-2045
Description 4.20mm (.165) Pitch Mini-Fit Jr. Header, Single Row, Vertical, with Snap-in Plastic Peg PCB Lock, 4 Circuits

File Size 456.39K  /  5 Page

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Amphenol Communications Solutions

Part No. 68020-454HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 54 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    14-56-2045

Molex Electronics Ltd.
Part No. 14-56-2045
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version A, Nonpolarized, Wire Size 28, 0.38μm (15μ) Gold (Au), 4 Circuits

File Size 152.15K  /  3 Page

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Amphenol Communications Solutions

Part No. 51732-045LF
Description PwrBlade®, Power Supply Connectors, 4P 20S Right Angle Header.
Tech specs    

Official Product Page

    IEC-1140

Level One
Part No. IEC-1140
Description    10/100 Industrial Media Converter, SC SM 40KM

File Size 166.22K  /  2 Page

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Amphenol Communications Solutions

Part No. 10124620-4555P00LF
Description AirMax® Power Connectors, Backplane Connectors, 2-Pair, 2 Column, Right Angle Receptacle, Press-Fit
Tech specs    

Official Product Page

    SPM-2045

STANFORD[Stanford Microdevices]
Part No. SPM-2045
Description High Linearity Passive FET Mixer

File Size 192.45K  /  9 Page

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Amphenol Communications Solutions

Part No. 68020-450HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1140-4028

Molex Electronics Ltd.
Part No. 1140-4028
Description Insulation Punch

File Size 11.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 61083-204502LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

    1140-4027

Molex Electronics Ltd.
Part No. 1140-4027
Description Conductor Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 61083-204509LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

    D1140

Toshiba Semiconductor
Part No. D1140
Description Search --To 2SD1140

File Size 224.30K  /  4 Page

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Amphenol Communications Solutions

Part No. 67292-045LF
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 90 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs    

Official Product Page

    1140-4018

Molex Electronics Ltd.
Part No. 1140-4018
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 20021832-04510T1LF
Description Minitek127®, Board to Board Stacking Header , Surface Mount, Double Row, 10 positions, 1.27mm (0.500in) pitch.
Tech specs    

Official Product Page

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