12T4 pdf Datasheet P5 Part Num --- IC-ON-LINE


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12T4 Datasheet PDF File

For 12T4 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

					Taiyo Yuden (U.S.A.), I...
Part No.	LBC2012T470K
Description	Wire-wound Chip Inductors (LB series)
File Size	131.67K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	20021221-00012T4LF
Description	Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 12 Positions, 1.27mm (0.500in) Pitch.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Taiyo Yuden (U.S.A.), I...
Part No.	CBC2012T470K
Description	Wire-wound Chip Power Inductors
File Size	129.67K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	20021612-00012T4LF
Description	1.27mm (0.05in.) pitch, Header with eject latch, 12 contacts
Tech specs				Official Product Page

					Semikron International
Part No.	SKM150GB12T4-13
Description	Fast IGBT4 Modules
File Size	456.26K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	20021511-00012T4LF
Description	1.27mm (0.05in.) pitch, Shrouded header, 12 contacts
Tech specs				Official Product Page

					Semikron International
Part No.	SKM300GA12T4-13
Description	Fast IGBT4 Modules
File Size	385.27K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	59112-T40-20-090LF
Description	Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 40 Positions.
Tech specs				Official Product Page

					Taiyo Yuden (U.S.A.), I...
Part No.	BRL2012T470M
Description	Wire-wound Chip Power Inductors
File Size	125.53K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	G886B04012T4HR
Description	Wafer 1.5mm Pitch STR Surfacemount, 1x4Pin, MATTE TIN, NY9T, COLOR-NATURAL
Tech specs				Official Product Page

					Semikron International
Part No.	SK100GD12T4T
Description	IGBT Module
File Size	908.32K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	20021111-00012T4LF
Description	Minitek127®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 12 Positions, 1.27mm (0.050in) pitch.
Tech specs				Official Product Page

					Semikron International
Part No.	SKM300GM12T4
Description	Fast IGBT4 Modules
File Size	155.02K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	20021611-00012T4LF
Description	1.27mm (0.05in.) pitch, Header with eject latch, 12 contacts
Tech specs				Official Product Page

					Taiyo Yuden (U.S.A.), Inc Taiyo Yuden (U.S.A.), I...
Part No.	BRL2012T4R7M
Description	Wire-wound Chip Power Inductors (BR series)
File Size	125.77K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	59112-T40-11-143LF
Description	Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 22 Positions.
Tech specs				Official Product Page

					Semikron International
Part No.	25AC12T4V108
Description	3-phase bridge inverter
File Size	1,424.88K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	59112-T40-15-155LF
Description	Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 30 Positions.
Tech specs				Official Product Page

					Semikron International
Part No.	11AC12T4V108
Description	3-phase bridge inverter
File Size	992.92K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	20021211-00012T4LF
Description	Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 12 Positions, 1.27 mm (.050in) Pitch.
Tech specs				Official Product Page

For 12T4 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

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