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  164 Datasheet PDF File

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    90160-0164

Molex Electronics Ltd.
Part No. 90160-0164
Description 2.54mm Pitch C-Grid III?Crimp Housing Dual Row, 64 Circuits

File Size 26.44K  /  1 Page

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HUA FENG CIRCUIT





    90160-0164

Molex Electronics Ltd.
Part No. 90160-0164
Description 2.54mm (.100) Pitch C-Grid III Crimp Housing - Dual Row, 64 Circuits

File Size 158.20K  /  2 Page

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    Yageo
Part No. YC164-XXXX
Description Chip Resistors Array

File Size 384.84K  /  6 Page

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    SC-12-10T SD-19164-017

http://
Molex Electronics Ltd.
Part No. SC-12-10T SD-19164-017
Description Perma-Seal?/a> Butt Splice for 10-12 AWG Wire
Perma-Seal Butt Splice for 10-12 AWG Wire

File Size 98.09K  /  3 Page

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    SC-201-12 SD-19164-041

Molex Electronics Ltd.
Part No. SC-201-12 SD-19164-041
Description Perma-Seal?/a> Ring Tongue Terminal
Perma-Seal Ring Tongue Terminal

File Size 99.69K  /  2 Page

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    SB-227-08 SD-19164-027

Molex Electronics Ltd.
Part No. SB-227-08 SD-19164-027
Description Perma-Seal Spade Tongue Terminal

File Size 76.93K  /  2 Page

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    FMXJ-2164S

Sanken Electric Co.,Ltd.
Part No. FMXJ-2164S
Description Ultra-Fast-Recovery Rectifier Diode

File Size 320.69K  /  8 Page

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    90572-1642

Molex Electronics Ltd.
Part No. 90572-1642
Description 2.54mm (.100) Pitch QF-50 Header, Right Angle, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 64 Circuits, 0.76 μm Gold (Au)

File Size 215.87K  /  4 Page

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    HDMP-1636 HDMP-1646

Dantona Industries, Inc.
HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
Part No. HDMP-1636 HDMP-1646
Description Gigabit Ethernet Transceiver Chip 千兆以太网收发器芯片
Software

File Size 314.09K  /  15 Page

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    3-1000Z 8164/3-1000Z

List of Unclassifed Manufacturers
Part No. 3-1000Z 8164/3-1000Z
Description HIGH-MU POWER TRIODE

File Size 440.55K  /  4 Page

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Part: 1646T48REA12V-DB
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