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Amphenol Communications Solutions |
Part No. |
95278-101A14
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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NXP Semiconductors N.V.
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Part No. |
LPC11A11FHN33 LPC11A14FHN33 LPC11A12FHN33
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Description |
32-bit ARM Cortex-M0 microcontroller??kB flash, 2kB SRAM, HVQFN32 package 32-bit ARM Cortex-M0 microcontroller??2kB flash, 8kB SRAM, HVQFN32 package 32-bit ARM Cortex-M0 microcontroller??6kB flash, 4kB SRAM, HVQFN32 package
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File Size |
1,824.47K /
84 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
G881A14102T3EU
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Description |
Micro Power 3.0 Connector System - G881 Series, Wire to Board connector, , Vertical, Dual row, 3.0mm pitch, 14 positions , 100u\\ Tin, 3.20mm tail length, LCP, Black, TRAY
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
G881A14001TEU
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Description |
Micro Power 3.0 Connector System - G881 Series, Wire to Board connector, , Right Angle, Dual row, 3.0mm pitch, 14 positions , 100u\\ Tin, 3.20mm tail length, LCP, Black, TRAY
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-501A14LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-801A14LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-401A14LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, Tin plating, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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NXP Semiconductors
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Part No. |
LPC11A02UK LPC11A04UK LPC11A14FHN33 LPC11A12FBD48 LPC11A14FBD48 LPC11A13FHI33
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Description |
16kB flash, 4kB SRAM, WLCSP package 32kB flash, 8kB SRAM, WLCSP package 32kB flash, 8kB SRAM, HVQFN32 package 16kB flash, 4kB SRAM, LQFP48 package 32kB flash, 8kB SRAM, LQFP48 package 24kB flash, 6kB SRAM, HVQFN32 package
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File Size |
1,819.68K /
84 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
10076801-101A14LF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 14 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
98401-101A14LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
G881A14102TEU
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Description |
Micro Power 3.0 Connector System - G881 Series, Wire to Board connector, Vertical, Dual row, 3.0mm pitch, 14 positions , 100u\\ Tin, 3.20mm tail length, LCP, Black, TRAY
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
98401-401A14LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
Part: 1A1G04QDBVRG4Q1 |
Maker: Texas Instruments |
Pack: ETC |
Stock: Reserved |
Unit price
for : |
50: $0.00 |
100: $0.00 |
1000:
$0.00 |
Email: oulindz@gmail.com |
Contact us |
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