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  31402-2200 Datasheet PDF File

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    31402-2200

Molex Electronics Ltd.
Part No. 31402-2200
Description 2.54mm MX64 Sealed Single Row Crimp Housing

File Size 30.13K  /  1 Page

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Rochester Electronics LLC

Part No. AM27C512-200DI
Description AM27C512 - 512K (64K x 8) CMOS EPROM
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SEMIKRON
Part No. SKBB250C3200/2200
Description Miniature Bridge Rectifiers 2.7 A, 800 V, SILICON, BRIDGE RECTIFIER DIODE

File Size 74.94K  /  4 Page

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Amphenol Communications Solutions

Part No. 68031-402HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 2 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
Tech specs    

Official Product Page

    Semikron
Part No. SKBB250C3200/2200
Description BRIDGE RECTIFIER

File Size 68.38K  /  4 Page

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Amphenol Communications Solutions

Part No. RJE7B1831402
Description Modular Jack - 8P8C, RA, Cat6A, THT, Blue Housing, Recessed Profile, Single Port, Shield With Top and Side EMI Tabs, No LEDs
Tech specs    

Official Product Page

    Molex Inc.
Part No. 31402-6100
Description
File Size 30.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 10134040-22000LF
Description HPCE CTB VT HEADER 4LP With latch
Tech specs    

Official Product Page

    31402-2510

Molex Electronics Ltd.
Part No. 31402-2510
Description 2.54mm MX64 Sealed Single Row Crimp Housing

File Size 30.12K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-822-00LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 00 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    31402-3100

Molex Electronics Ltd.
Part No. 31402-3100
Description 2.54mm MX64 Sealed Single Row Crimp Housing

File Size 45.75K  /  1 Page

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Amphenol Communications Solutions

Part No. CE1220000110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole/Surface mount, 2 power pins, 200 signal pins, Vertical
Tech specs    

Official Product Page

    HMC31402

Hittite Microwave Corporation
Part No. HMC31402
Description GaAs InGaP HBT MMIC DRIVER AMPLIFIER, 0.7 - 4.0 GHz

File Size 246.48K  /  6 Page

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Amphenol Communications Solutions

Part No. 20021122-00046D8LF
Description Minitek127® 1.27mm, Board To Board, Unshrouded header, Surface Mount, 46 contacts.
Tech specs    

Official Product Page

    TE Connectivity, Ltd.
Rhombus Industries, Inc.
Bel Fuse, Inc.
Part No. MP3-Y22200/250/20LL40MM MP3-Y20.015/250/20LL40MM MP3-Y24700/250/20LL40MM
Description CAPACITOR, METALLIZED PAPER, 0.0022 uF, THROUGH HOLE MOUNT RADIAL LEADED
CAPACITOR, METALLIZED PAPER, 0.015 uF, THROUGH HOLE MOUNT RADIAL LEADED
CAPACITOR, METALLIZED PAPER, 0.0047 uF, THROUGH HOLE MOUNT RADIAL LEADED

File Size 358.77K  /  2 Page

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Amphenol Communications Solutions

Part No. 20021122-00028D8LF
Description Minitek127® 1.27mm, Board To Board, Unshrouded header, Surface Mount, 28 contacts.
Tech specs    

Official Product Page

    31402-2400 CVP31402-2400

Molex Electronics Ltd.
Part No. 31402-2400 CVP31402-2400
Description 2.54mm MX64 Sealed Single Row Crimp Housing

File Size 30.12K  /  1 Page

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Amphenol Communications Solutions

Part No. 20021122-00050D8LF
Description Minitek127® 1.27mm, Board To Board, Unshrouded header, Surface Mount, 50 contacts.
Tech specs    

Official Product Page

    CVP31402-2700

Molex Electronics Ltd.
Part No. CVP31402-2700
Description 2.54mm MX64 Sealed Single Row Crimp Housing

File Size 30.12K  /  1 Page

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Amphenol Communications Solutions

Part No. 20021122-00022T1LF
Description Minitek127® 1.27mm, Board To Board, Unshrouded header, Surface Mount, 22 contacts.
Tech specs    

Official Product Page

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