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  31402-2510 Datasheet PDF File

For 31402-2510 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    31402-2510

Molex Electronics Ltd.
Part No. 31402-2510
Description 2.54mm MX64 Sealed Single Row Crimp Housing

File Size 30.12K  /  1 Page

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Rochester Electronics LLC

Part No. MD82510/B
Description 82510 - Serial I/O Controller, CMOS, CDIP28
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Austin Semiconductor, Inc
Part No. EHA4-2510/883B EHA9-2510/883B
Description Dual Micropower, Single Supply, Rail-to-Rail Input and Output (RRIO) Instrumentation Amplifier; Temperature Range: Full-Range Ind; Package: 16-QSOP T&R
Light-to-Digital Sensor; Temperature Range: -40&deg;C to 85&deg;C; Package: 6-DFN 电压反馈运算放大

File Size 190.73K  /  1 Page

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Rochester Electronics LLC

Part No. MR82510/B
Description 82510 - Serial I/O Controller, CMOS
Tech specs    

Official Product Page

    INTERSIL[Intersil Corporation]
Part No. HA2-2510_883 HA7-2510_883 HA-2510_06 HA2-2510/883
Description High Slew Rate Operational Amplifier

File Size 204.59K  /  7 Page

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Amphenol Communications Solutions

Part No. 68031-402HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 2 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
Tech specs    

Official Product Page

    Molex Inc.
Part No. 31402-6100
Description
File Size 30.44K  /  1 Page

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Amphenol Communications Solutions

Part No. RJE7B1831402
Description Modular Jack - 8P8C, RA, Cat6A, THT, Blue Housing, Recessed Profile, Single Port, Shield With Top and Side EMI Tabs, No LEDs
Tech specs    

Official Product Page

    31402-3100

Molex Electronics Ltd.
Part No. 31402-3100
Description 2.54mm MX64 Sealed Single Row Crimp Housing

File Size 45.75K  /  1 Page

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Amphenol Communications Solutions

Part No. 48251-000LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs    

Official Product Page

    31402-2200

Molex Electronics Ltd.
Part No. 31402-2200
Description 2.54mm MX64 Sealed Single Row Crimp Housing

File Size 30.13K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-510202000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    HMC31402

Hittite Microwave Corporation
Part No. HMC31402
Description GaAs InGaP HBT MMIC DRIVER AMPLIFIER, 0.7 - 4.0 GHz

File Size 246.48K  /  6 Page

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Amphenol Communications Solutions

Part No. 10118251-006LF
Description HPCE VT Receptacle 36P24S
Tech specs    

Official Product Page

    31402-2110 CVP31402-2110

Molex Electronics Ltd.
Part No. 31402-2110 CVP31402-2110
Description 2.54mm MX64 Sealed Single Row Crimp Housing

File Size 30.13K  /  1 Page

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Amphenol Communications Solutions

Part No. 10127225-107501ULF
Description ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System, Hermaphroditic, Vertical, Press-Fit, 2 Pair, 19 Column, 152 Position, 7.50mm Stack Height, 2.00mm (0.079in) Column Pitch
Tech specs    

Official Product Page

    31402-2400 CVP31402-2400

Molex Electronics Ltd.
Part No. 31402-2400 CVP31402-2400
Description 2.54mm MX64 Sealed Single Row Crimp Housing

File Size 30.12K  /  1 Page

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Amphenol Communications Solutions

Part No. L17TF2510101
Description Dsub, Stamped Signal 3A, Straight PCB Press-Fit, 25 Pin, Bright Tin Shell+Grounding Dimples, Flash Gold, 4-40 Threaded Rear Insert, Without Boardlock
Tech specs    

Official Product Page

    CVP31402-2700

Molex Electronics Ltd.
Part No. CVP31402-2700
Description 2.54mm MX64 Sealed Single Row Crimp Housing

File Size 30.12K  /  1 Page

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Amphenol Communications Solutions

Part No. 73725-1010BLF
Description USB 2.0, Input Output Connectors, Receptacle, Type A, Up Right, Right Angle, Through Hole, Single Deck, 4 Positions, With Sensor Contact
Tech specs    

Official Product Page

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