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DUR14C2 5218AL S24IZ SP7615EB EL7571CM 03040 MC9S0 2057AH
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  53240-1 Datasheet PDF File

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Part No. 53240-1
Description 1.65 mm2, BRASS, TIN FINISH, FORK TERMINAL

File Size 37.01K  /  1 Page

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Amphenol Communications Solutions

Part No. 10132153-240824ALF
Description 10132153-240824ALF-HPCE MEZZANINE 6HP4LP24
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    LH5324000 LH532400D

SHARP[Sharp Electrionic Components]
Sharp Corporation
Part No. LH5324000 LH532400D
Description CMOS 24M(3M x 8) Mask-Programmable ROM
CMOS 24M (3M x 8) MROM

File Size 51.53K  /  6 Page

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    51353-2400 0513532400

Molex Electronics Ltd.
Part No. 51353-2400 0513532400
Description 2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive LockDual Row, 24 circuits

File Size 242.32K  /  3 Page

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Part No. AK5324096WP-70
Description x32 Fast Page Mode DRAM Module

File Size 69.42K  /  2 Page

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    AK5324096W4K

Accutek Microcircuit Corporation
Part No. AK5324096W4K
Description 4,194,304 Word by 32 Bit CMOS Dynamic Random Access Memory

File Size 60.93K  /  2 Page

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    KMM5324000BSW

Samsung Semiconductor
Part No. KMM5324000BSW
Description 4MBx32 DRAM Simm Using 4MBx16

File Size 345.03K  /  18 Page

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    KMM5324004BSW

Samsung Semiconductor
Part No. KMM5324004BSW
Description 4MBx32 DRAM Simm Using 4MBx16

File Size 389.28K  /  19 Page

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    KMM5324004CSW

Samsung Semiconductor
Part No. KMM5324004CSW
Description 4MBx32 DRAM Simm Using 4MBx16

File Size 422.25K  /  21 Page

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    SAMSUNG[Samsung semiconductor]
Part No. KMM5324004CSWG KMM5324004CSW
Description 4M x 32 DRAM SIMM Using 4Mx16, 4K Refresh, 5V

File Size 426.11K  /  21 Page

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    SAMSUNG[Samsung semiconductor]
Part No. KMM5324004BSWG KMM5324004BSW
Description 4M x 32 DRAM SIMM Using 4Mx16, 4K Refresh, 5V

File Size 393.13K  /  19 Page

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