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  56043 Datasheet PDF File

For 56043 Found Datasheets File :: 43+       Page :: | <1> | 2 | 3 | 4 | 5 |   

    K4S560432J

Samsung semiconductor
Part No. K4S560432J
Description 256Mb J-die SDRAM Specification

File Size 320.51K  /  15 Page

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Amphenol Communications Solutions

Part No. 10073456-043LF
Description Quickie Header, Wire to Board Connector, Double Row, 34 Positions, Press-Fit Slimline Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S560432A K4S560432A-TC_L75 K4S560432A-TC_L80 K4S560432A-TC_L1H K4S560432A-TC_L1L K4S560432A-TC/L80 K4S560432A-TC/L1L K4S560432A-TC/L1H K4S560432A-TC/L75
Description 256Mbit SDRAM 16M x 4bit x 4 Banks Synchronous DRAM LVTTL 56Mbit SDRAM16米x 4位4银行同步DRAM LVTTL
256Mbit SDRAM 16M x 4bit x 4 Banks Synchronous DRAM LVTTL 56Mbit SDRAM6米x 4位4银行同步DRAM LVTTL

File Size 126.16K  /  10 Page

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Amphenol Communications Solutions

Part No. 55604-302ALF
Description DX VCC DR 100 DP SMT
Tech specs    

Official Product Page

   
Part No. K4S560432C-TC75 K4S560432C-TC7C0
Description 64M X 4 SYNCHRONOUS DRAM, 5.4 ns, PDSO54

File Size 114.00K  /  11 Page

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Amphenol Communications Solutions

Part No. 10136656-0431LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 4 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    Samsung Electronic
Part No. K4S560432D-NC75 K4S560432D-NC7C K4S560432D-NC1H K4S560432D-NL1L
Description 256Mbit SDRAM, LVTTL, 133MHz

File Size 81.46K  /  9 Page

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Amphenol Communications Solutions

Part No. 10136656-0432LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 4 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    K4S560432B-TC_L1H K4S560432B-TC_L1L K4S560432B-TC_L75 K4S560432B K4S560432B-TC/L75 K4S560432B-TC/L1L K4S560432B-TC/L1H

Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4S560432B-TC_L1H K4S560432B-TC_L1L K4S560432B-TC_L75 K4S560432B K4S560432B-TC/L75 K4S560432B-TC/L1L K4S560432B-TC/L1H
Description 256Mbit SDRAM 16M x 4bit x 4 Banks Synchronous DRAM LVTTL 56Mbit SDRAM6x 4位4银行同步DRAM LVTTL

File Size 128.98K  /  11 Page

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Amphenol Communications Solutions

Part No. 10136656-0431NLF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 4 Positions, Natural Color, GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S560432D-TL7C K4S560432D-TL75 K4S560432D-TC1H K4S560432D K4S560432D-TC75 K4S560432D-TL1H K4S560432D-TC1L K4S560432D-TC7C K4S560432D-TL1L
Description 16M x 4bit x 4 Banks Synchronous DRAM LVTTL 16米x 4位4银行同步DRAM LVTTL

File Size 109.58K  /  11 Page

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Amphenol Communications Solutions

Part No. 10136656-0432NLF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 4 Positions, Natural Color, Non GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4T56083QF-GCD5 K4T56083QF-ZCD5 K4T56043QF-GCD5 K4T56043QF-ZCD5
Description 256Mb F-die DDR2 SDRAM
OSC 3.3V SMT 7X5 CMOS 256Mb的的F - DDR2内存芯片

File Size 479.59K  /  27 Page

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    Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Part No. K4H560838E-GCCC K4H560438E-GCC4 K4H560438E-GCCC K4H560838E-GCC4
Description DIODE ZENER SINGLE 300mW 27Vz 5mA-Izt 0.02503 0.05uA-Ir 21 SOT-23 3K/REEL 256Mb的电子芯片的DDR 400内存规格60Ball FBGA封装(x4/x8
DIODE ZENER SINGLE 300mW 29.8Vz 5mA-Izt 0.02503 0.05uA-Ir 23 SOT-23 3K/REEL
256Mb E-die DDR 400 SDRAM Specification 60Ball FBGA (x4/x8)

File Size 195.42K  /  18 Page

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    Samsung Semiconductor Co., Ltd.
Part No. K4H560438E-ZLB30 K4H560838E-ZLB30
Description 64M X 4 DDR DRAM, 0.7 ns, PBGA60 ROHS COMPLIANT, FBGA-60
32M X 8 DDR DRAM, 0.7 ns, PBGA60 ROHS COMPLIANT, FBGA-60

File Size 385.02K  /  24 Page

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    SAMSUNG[Samsung semiconductor]
Part No. K4H560838E-NLB3 K4H560438E-NC K4H560438E-NC_LA2 K4H560438E-NC_LB0 K4H560438E-NC_LB3 K4H560438E-NCA2 K4H560438E-NCB0 K4H560438E-NCB3 K4H560438E-NLA2 K4H560438E-NLB0 K4H560438E-NLB3 K4H560838E-NC_LA2 K4H560838E-NC_LB0 K4H560838E-NC_LB3 K4H560838E-NCA2 K4H560838E-NCB0 K4H560838E-NCB3 K4H560838E-NLA2 K4H560838E-NLB0
Description 256Mb E-die DDR SDRAM Specification 54pin sTSOP(II)

File Size 212.16K  /  24 Page

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For 56043 Found Datasheets File :: 43+       Page :: | <1> | 2 | 3 | 4 | 5 |   

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