70567-0152 pdf Datasheet P1 Part Num --- IC-ON-LINE

Amphenol Communications Solutions

Part No.

Description

BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in) Pitch.

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70567-0152 Datasheet PDF File

For 70567-0152 Found Datasheets File :: 150+ Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

				Molex Electronics Ltd.
Part No.	70567-0152 A-70567-0152 15-80-0365 0015800365
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits
File Size	1,218.29K / 7 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	A-70567-0022
Description	2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, Tin (Sn) Plating
File Size	1,218.42K / 7 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	A-70567-0021
Description	2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, Tin (Sn) Plating
File Size	1,218.42K / 7 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	A-70567-0020
Description	2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, Tin (Sn) Plating
File Size	1,218.41K / 7 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	70567-0018
Description	2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating
File Size	1,218.45K / 7 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	70567-0125
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating
File Size	1,211.75K / 7 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	A-70567-0019
Description	2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, Tin (Sn) Plating
File Size	1,218.42K / 7 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	A-70567-0279
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
File Size	1,218.38K / 7 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	70567-0120
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating
File Size	1,211.71K / 7 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	70567-0143 15-80-0185
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size	1,218.29K / 7 Page	View it Online	Download Datasheet

For 70567-0152 Found Datasheets File :: 150+ Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |