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T114003 FMBBA LRU2621R ADV7513 2SA1761 CAP005DG KIT3033S SI1001
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  7100.1063.XX Datasheet PDF File

For 7100.1063.XX Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    QR06A-2/106350 QR06A-2/106352 QR06A-2/106349 QR06A-2/106351 QR06A-2106349

ebm-papst
Part No. QR06A-2/106350 QR06A-2/106352 QR06A-2/106349 QR06A-2/106351 QR06A-2106349
Description Crossflow Blower

File Size 296.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-106341050LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    MIC37100/37101/37102

Micrel Semiconductor
Part No. MIC37100/37101/37102
Description 1A Low-Voltage Cap LDO Regulator

File Size 125.66K  /  14 Page

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Amphenol Communications Solutions

Part No. 54242-106301300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Molex, Inc.
Part No. 10-63-1063
Description 10631063 6 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

File Size 53.81K  /  1 Page

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Amphenol Communications Solutions

Part No. 54121-106360800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Molex, Inc.
MOLEX INC
Part No. 22-01-1063 22-01-1123
Description Connector Housing; Gender:Female; Number of Contacts:6; Series:5051-NM; Body Material:PA Polyamide (Nylon) 6/6; Number of Rows:1; Pitch Spacing:2.5mm 6 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP
CRIMP HOUSING, 2.5MM 12WAY ; Ways, No. of:12; Colour:White; Current rating:2.5A; Dielectric strength:1500V/m; Flammability rating:UL94V-0; Force, de-mating:0.5N; Force, mating:2N; Housing type:White Nylon UL94V-0; Material:Nylon;

File Size 64.52K  /  1 Page

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Amphenol Communications Solutions

Part No. 54121-106361000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    HGLM-1063

Agilent (Hewlett-Packard)
Agilent(Hewlett-Packard)
Part No. HGLM-1063
Description Fibre Channel GBaud Optical Link Module

File Size 185.53K  /  10 Page

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Amphenol Communications Solutions

Part No. 54121-106361250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    39-00-0039 39-28-1063

MolexKits
Part No. 39-00-0039 39-28-1063
Description Vertical Header and Receptacle, 6 Circuit

File Size 30.11K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-106361100LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 36 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    STMicroelectronics N.V.
Part No. HGLM-1063
Description Fibre Channel GBaud Optical Link Module 光纤通道GBaud光链路模

File Size 196.04K  /  10 Page

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Amphenol Communications Solutions

Part No. 54122-106301000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 30 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    B1063

Panasonic Semiconductor
Part No. B1063
Description Search --To 2SB1063

File Size 100.14K  /  3 Page

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Amphenol Communications Solutions

Part No. 10127721-063GRLF
Description Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 6 Position, 3.2mm Kink Tail (15u\\ Gold) plating, GW Compatible LCP, Black Color,Tape and Reel with cap.
Tech specs    

Official Product Page

    POLYFET[Polyfet RF Devices]
Part No. F1063
Description PATENTED GOLD METALIZED SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR

File Size 31.59K  /  2 Page

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Amphenol Communications Solutions

Part No. 54242-106361050LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    23
22
20
MICROPAC[Micropac Industries]
Micropac Industries, Inc.
Part No. 61063-101 61063 61063-001
Description PHOTODIODE “PILL PACK?/a>
PHOTODIODE PILL PACK Micropac Industries
PHOTODIODE “PILL PACK”
PHOTODIODE B>PILL PACK
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT06; Number of Contacts:3; Connector Shell Size:8; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight PHOTO DIODE
PHOTODIODE PILL PACK 光电二极管“丸包装

File Size 75.29K  /  2 Page

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Amphenol Communications Solutions

Part No. 54111-106361500LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 7100.1063.XX Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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