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  73644-3008 Datasheet PDF File

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    0736443008 73644-3008

Molex Electronics Ltd.
Part No. 0736443008 73644-3008
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position E, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position E, 144 Circuits

File Size 174.33K  /  4 Page

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Amphenol Communications Solutions

Part No. 51760-10300803AALF
Description PwrBlade®, Power Supply Connectors, 3P 8S 3P STB Right Angle Receptacle.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    H8/3008

Renesas Electronics Corporation
Part No. H8/3008
Description Renesas 16-Bit Single-Chip Microcomputer H8 Family/H8/300H Series

File Size 3,709.87K  /  686 Page

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Amphenol Communications Solutions

Part No. 54202-S3008LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ACTR3008_303.825_QCC4A ACTR3008/303.825/QCC4A

Advanced Crystal Technology
Part No. ACTR3008_303.825_QCC4A ACTR3008/303.825/QCC4A
Description true one-port, surface-acoustic-wave (SAW) resonator

File Size 60.17K  /  3 Page

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Amphenol Communications Solutions

Part No. 51730-083LF
Description PwrBlade®, Power Supply Connectors, 1P 16S 1P Right Angle Header.
Tech specs    

Official Product Page

    Z80C30-10CME Z85C3008CME Z85C3008/CMB Z85C3010CMB Z85C3010CME

ZiLOG, Inc.
Part No. Z80C30-10CME Z85C3008CME Z85C3008/CMB Z85C3010CMB Z85C3010CME
Description FUSEHOLDR 2AG PNL MNT SOLDER QC
Cartridge Fuse; Current Rating:80mA; Voltage Rating:250V; Fuse Type:Time Delay; Fuse Size/Group:5 x 20 mm; Body Material:Glass; Diameter:5mm; Fuse Terminals:Ferrule; Length:20mm; Series:218XE 通信控制
Communications Controller 通信控制

File Size 2,876.24K  /  39 Page

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Amphenol Communications Solutions

Part No. 66953-008
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Mount, Top Entry, Double Row, 16 Position ,2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    73644-2116

Molex Electronics Ltd.
Part No. 73644-2116
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits

File Size 163.64K  /  4 Page

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Amphenol Communications Solutions

Part No. 54102-T30-08
Description 54102-T30-08-B/S.100\\ HDR
Tech specs    

Official Product Page

    73644-1206

Molex Electronics Ltd.
Part No. 73644-1206
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position D, 144 Circuits

File Size 159.58K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-802300800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    73644-2117

Molex Electronics Ltd.
Part No. 73644-2117
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A

File Size 163.63K  /  4 Page

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Amphenol Communications Solutions

Part No. 75543-008LF
Description PV® Wire-to-Board Connector System, Crimp to Wire Terminal Receptacle for 32-36 AWG Wire.
Tech specs    

Official Product Page

    73644-1203

Molex Electronics Ltd.
Part No. 73644-1203
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A

File Size 159.58K  /  4 Page

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Amphenol Communications Solutions

Part No. 67013-008LF
Description Berg Duflex Housing, single row, 8 Position.
Tech specs    

Official Product Page

    73644-1205

Molex Electronics Ltd.
Part No. 73644-1205
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position C, 144 Circuits

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-803300850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    73644-1204

Molex Electronics Ltd.
Part No. 73644-1204
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position C, 144 Circuits

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 59202-G30-08-052LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions.
Tech specs    

Official Product Page

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