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Texas Instruments |
| Part No. |
TPS79147DBVTG4
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| Description |
Ultralow Noise, High PSRR, Fast RF 100-mA Low-Dropout Linear Regulators 5-SOT-23 -40 to 125
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| Tech specs |
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Get Free Sample |
Official Product Page
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Texas Instruments |
| Part No. |
TPS79147DBVREP
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| Description |
Enhanced Product Ultralow Noise High Psrr Fast Rf 100-Ma Low-Dropout Linear Regulator 5-SOT-23 -40 to 125
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-3616 0879143616
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.41K /
48 Page |
 View
it Online |
Download Datasheet
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Texas Instruments |
| Part No. |
TPS79147DBVT
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| Description |
Ultralow Noise, High PSRR, Fast RF 100-mA Low-Dropout Linear Regulators 5-SOT-23 -40 to 125
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| Tech specs |
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Get Free Sample |
Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-2216 0879142216
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Texas Instruments |
| Part No. |
TPS79147DBVR
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| Description |
Ultralow Noise, High PSRR, Fast RF 100-mA Low-Dropout Linear Regulators 5-SOT-23 -40 to 125
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143016 87914-3016
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Analog Devices |
| Part No. |
AD7914BRUZ
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| Description |
10-Bit 4,CH 1 Msps ADC I.C.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143203 87914-3203
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 2.54μm (1.00μ) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 2.54渭m (1.00渭) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
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| File Size |
759.86K /
11 Page |
View
it Online |
Download Datasheet |
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Analog Devices |
| Part No. |
AD7914BRUZ-REEL7
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| Description |
10-Bit 4,CH 1 Msps ADC I.C.
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| Tech specs |
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Official Product Page
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Analog Devices |
| Part No. |
AD7914WYRUZ-REEL7
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| Description |
10-Bit 4,CH 1 Msps ADC I.C.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143216 87914-3216
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
86093967914755ELF
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| Description |
DIN Straight Header Press-Fit Style HE11 96 ways, Class II
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143416 87914-3416
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.41K /
48 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
75844-879-14LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143435 87914-3435
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating, Tray Packaging, Lead-free
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| File Size |
3,776.94K /
48 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68779-144HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: 7910CE |
| Maker: N/A |
| Pack: DIP |
| Stock: 10 |
| Unit price
for : |
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50: $3.32 |
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100: $3.16 |
| 1000:
$2.99 |
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