80012 pdf Datasheet P1 Part Num --- IC-ON-LINE


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80012 Datasheet PDF File

For 80012 Found Datasheets File :: 42+ Page :: | <1> | 2 | 3 | 4 | 5 |

					Maxim Integrated Products
Part No.	DS2482-800 DS2482-80012
Description	8-Channel 1-Wire Master
File Size	399.25K / 23 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10125112-080012CLF
Description	HPCE BTB R/A Receptacle 8P12S WITH GUIDE
Tech specs				Official Product Page

HUA FENG CIRCUIT

					NXP Semiconductors N.V.
Part No.	BT139-800127
Description	Triacs - I<sub>GT</sub>: 35 mA; I<sub>T</sub> (R<sub>MS</sub>): 16 A; V<sub>DRM</sub>: 800 V; Package: SOT78 (TO-220AB); Container: Tube pack 800 V, 16 A, 4 QUADRANT LOGIC LEVEL TRIAC, TO-220AB
File Size	175.33K / 14 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10125023-080012ALF
Description	HPCE BTB VT RECEPT 8P12S
Tech specs				Official Product Page

					SUYIN USA, INC.
Part No.	800120MA
Description	0.8 mm PITCH DUAL ROW PIN HEADER SMD TYPE
File Size	124.49K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68001-205HLF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 5 Positions, 2.54 mm (0.100in) Pitch.
Tech specs				Official Product Page

					SUYIN USA, INC.
Part No.	800122MA
Description	0.8 mm PITCH DUAL ROW PIN HEADER SMD TYPE
File Size	123.40K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68001-226HLF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 26 Positions, 2.54 mm (0.100in) Pitch.
Tech specs				Official Product Page

					SUYIN USA, INC.
Part No.	800121MA
Description	0.8 mm PITCH DUAL ROW PIN HEADER SMD TYPE
File Size	116.85K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68001-203HLF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 3 Positions, 2.54 mm (0.100in) Pitch.
Tech specs				Official Product Page

					SUYIN USA, INC.
Part No.	800123FA
Description	0.8 mm PITCH DUAL ROW SOCKET SMD TYPE
File Size	112.49K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68001-205
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 5 Positions, 2.54 mm (0.100in) Pitch.
Tech specs				Official Product Page

					Vectron International, Inc
Part No.	VV-800-DAE-PAAN VV-800-DAE-KAAN VV-800-DAE-KABN VV-800-DAE-SAAN VV-800-DAW-KAAN VV-800-DAW-KABN VV-800-DAW-PAAN VV-800-DAW-PABN VV-800-DAW-SAAN VV-800-EAE-KAAN VV-800-EAE-KABN VV-800-EAE-PAAN VV-800-EAE-SAAN VV-800-EAW-KAAN VV-800-EAW-KABN VV-800-EAW-PAAN VV-800-EAW-SAAN VV-80012
Description	Voltage Controlled Crystal Oscillator Previous Vectron Model VVC4
File Size	203.93K / 6 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68001-202
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 2 Positions, 2.54 mm (0.100in) Pitch.
Tech specs				Official Product Page

					MITEQ INC
Part No.	AMF-6B-08001200-110-40P
Description	8000 MHz - 12000 MHz RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER
File Size	464.94K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68001-207HLF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 7 Positions, 2.54 mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	797580012
Description	Micro-Fit Female (Au) 20 AWG,UL1061,300MM
File Size	146.42K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68001-201H
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 1 Positions, 2.54 mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	15-80-0123 0015800123
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat Molex Electronics Ltd.
File Size	1,218.43K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68001-228HLF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 28 Positions, 2.54 mm (0.100in) Pitch.
Tech specs				Official Product Page

For 80012 Found Datasheets File :: 42+ Page :: | <1> | 2 | 3 | 4 | 5 |

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