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  80012 Datasheet PDF File

For 80012 Found Datasheets File :: 41+       Page :: | <1> | 2 | 3 | 4 | 5 |   

    DS2482-800 DS2482-80012

Maxim Integrated Products
Part No. DS2482-800 DS2482-80012
Description 8-Channel 1-Wire Master

File Size 399.25K  /  23 Page

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Amphenol Communications Solutions

Part No. 68001-203HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 3 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    NXP Semiconductors N.V.
Part No. BT139-800127
Description Triacs - I<sub>GT</sub>: 35 mA; I<sub>T</sub> (R<sub>MS</sub>): 16 A; V<sub>DRM</sub>: 800 V; Package: SOT78 (TO-220AB); Container: Tube pack 800 V, 16 A, 4 QUADRANT LOGIC LEVEL TRIAC, TO-220AB

File Size 175.33K  /  14 Page

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Amphenol Communications Solutions

Part No. 68001-205
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 5 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    800120MA

SUYIN USA, INC.
Part No. 800120MA
Description 0.8 mm PITCH DUAL ROW PIN HEADER SMD TYPE

File Size 124.49K  /  1 Page

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Amphenol Communications Solutions

Part No. 68001-202
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 2 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    800122MA

SUYIN USA, INC.
Part No. 800122MA
Description 0.8 mm PITCH DUAL ROW PIN HEADER SMD TYPE

File Size 123.40K  /  1 Page

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Amphenol Communications Solutions

Part No. 68001-207HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 7 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    800121MA

SUYIN USA, INC.
Part No. 800121MA
Description 0.8 mm PITCH DUAL ROW PIN HEADER SMD TYPE

File Size 116.85K  /  1 Page

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Amphenol Communications Solutions

Part No. 68001-201H
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 1 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    800123FA

SUYIN USA, INC.
Part No. 800123FA
Description 0.8 mm PITCH DUAL ROW SOCKET SMD TYPE

File Size 112.49K  /  1 Page

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Amphenol Communications Solutions

Part No. 68001-228HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 28 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    VV-800-DAE-PAAN VV-800-DAE-KAAN VV-800-DAE-KABN VV-800-DAE-SAAN VV-800-DAW-KAAN VV-800-DAW-KABN VV-800-DAW-PAAN VV-800-D

Vectron International, Inc
Part No. VV-800-DAE-PAAN VV-800-DAE-KAAN VV-800-DAE-KABN VV-800-DAE-SAAN VV-800-DAW-KAAN VV-800-DAW-KABN VV-800-DAW-PAAN VV-800-DAW-PABN VV-800-DAW-SAAN VV-800-EAE-KAAN VV-800-EAE-KABN VV-800-EAE-PAAN VV-800-EAE-SAAN VV-800-EAW-KAAN VV-800-EAW-KABN VV-800-EAW-PAAN VV-800-EAW-SAAN VV-80012
Description Voltage Controlled Crystal Oscillator Previous Vectron Model VVC4

File Size 203.93K  /  6 Page

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Amphenol Communications Solutions

Part No. 68001-212HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 12 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MITEQ INC
Part No. AMF-6B-08001200-110-40P
Description 8000 MHz - 12000 MHz RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER

File Size 464.94K  /  4 Page

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Amphenol Communications Solutions

Part No. 68001-206HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 6 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    797580012

Molex Electronics Ltd.
Part No. 797580012
Description Micro-Fit Female (Au) 20 AWG,UL1061,300MM

File Size 146.42K  /  2 Page

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Amphenol Communications Solutions

Part No. 68001-204HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 4 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    15-80-0123 0015800123

Molex Electronics Ltd.
Part No. 15-80-0123 0015800123
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
Molex Electronics Ltd.

File Size 1,218.43K  /  7 Page

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Amphenol Communications Solutions

Part No. 68001-215HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 15 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 80012 Found Datasheets File :: 41+       Page :: | <1> | 2 | 3 | 4 | 5 |   

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Part: 80021
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