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Amphenol Communications Solutions |
Part No. |
75160-806-10LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,10 position, 2.54mm pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54242-806100950LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54122-806161250LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
78061-0002 0780610002
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Description |
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38渭m (15渭) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins 1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38μm (15μ) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins
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File Size |
361.81K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68020-408-061033LF
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Description |
BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
78061-0001 0780610001
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Description |
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38渭m (15渭) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins 1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38μm (15μ) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins
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File Size |
361.88K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
59112-T3806-1400LF
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Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 6 Positions.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54112-808061500LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54112-806161000LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54121-806140900LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 14 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54122-806140850LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10142708-06100LF
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Description |
Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 6 Positions, 15u\\ Gold (100u\\ Tin on Tails) plating, GW Compatible LCP, With Pegs, Tray.
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Tech specs |
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Official Product Page
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Price and Availability
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