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  8061 Datasheet PDF File

For 8061 Found Datasheets File :: 146+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    FODM806110

Fairchild Semiconductor
Part No. FODM806110
Description High Noise Immunity, 3.3V/5V, 10Mbit/sec Logic Gate Output (Open Collector) Optocoupler

File Size 380.67K  /  12 Page

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Amphenol Communications Solutions

Part No. 75160-806-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,10 position, 2.54mm pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    78061-0012 0780610012

Molex Electronics Ltd.
Part No. 78061-0012 0780610012
Description 1.00mm (.039") Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76um (30u") Gold(Au) Selective Plating
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76um (30u) Gold(Au) Selective Plating

File Size 361.93K  /  7 Page

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Amphenol Communications Solutions

Part No. 54242-806100950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    78061-0011 0780610011

Molex Electronics Ltd.
Part No. 78061-0011 0780610011
Description 1.00mm (.039") Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76渭m (30渭") Gold(Au) Selective Plating, 240 Circuits
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76μm (30μ) Gold(Au) Selective Plating, 240 Circuits

File Size 361.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 54122-806161250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    78061-0002 0780610002

Molex Electronics Ltd.
Part No. 78061-0002 0780610002
Description 1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38渭m (15渭) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38μm (15μ) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins

File Size 361.81K  /  7 Page

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Amphenol Communications Solutions

Part No. 68020-408-061033LF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    78061-0001 0780610001

Molex Electronics Ltd.
Part No. 78061-0001 0780610001
Description 1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38渭m (15渭) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38μm (15μ) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins

File Size 361.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 59112-T3806-1400LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 6 Positions.
Tech specs    

Official Product Page

    0524180610 52418-0610

Molex Electronics Ltd.
Part No. 0524180610 52418-0610
Description 2.00mm (.079") Pitch Board-to-Board Receptacle, Right Angle, Single Row, FrictionLock, 6 Circuits
2.00mm (.079) Pitch Board-to-Board Receptacle, Right Angle, Single Row, FrictionLock, 6 Circuits

File Size 102.88K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-808061500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877580616 87758-0616

Molex Electronics Ltd.
Part No. 0877580616 87758-0616
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-806161000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877580617 87758-0617

Molex Electronics Ltd.
Part No. 0877580617 87758-0617
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 6 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.75K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-806140900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    47151-8061 0471518061

Molex Electronics Ltd.
Part No. 47151-8061 0471518061
Description 0.50mm (.020) Pitch HDMI* Receptacle, Right Angle, Through Hole Shell Tab Length 2.20mm (.087) with Dimple, Contact Gold (Au) Flash Plating, without Back Cover
0.50mm (.020") Pitch HDMI* Receptacle, Right Angle, Through Hole Shell Tab Length 2.20mm (.087") with Dimple, Contact Gold (Au) Flash Plating, without Back Cove

File Size 363.92K  /  6 Page

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Amphenol Communications Solutions

Part No. 54122-806140850LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0352780617

Molex Electronics Ltd.
Part No. 0352780617
Description 6.35mm (.250) Tab Width, Powermate Relay Housing, Female, Brown, 6 Circuits
6.35mm (.250") Tab Width, Powermate Relay Housing, Female, Brown, 6 Circuits

File Size 202.03K  /  3 Page

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Amphenol Communications Solutions

Part No. 10142708-06100LF
Description Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 6 Positions, 15u\\ Gold (100u\\ Tin on Tails) plating, GW Compatible LCP, With Pegs, Tray.
Tech specs    

Official Product Page

For 8061 Found Datasheets File :: 146+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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