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  87835-1042 Datasheet PDF File

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    87835-1042

Molex Electronics Ltd.
Part No. 87835-1042
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 106.32K  /  3 Page

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Amphenol Communications Solutions

Part No. 77317-104-26LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 26 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87835-3442

Molex Electronics Ltd.
Part No. 87835-3442
Description 2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 34 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating,
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,

File Size 106.14K  /  3 Page

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Amphenol Communications Solutions

Part No. 77319-104-20LF
Description BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Double Row, 20 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

    87835-1043

Molex Electronics Ltd.
Part No. 87835-1043
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 93.15K  /  3 Page

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Amphenol Communications Solutions

Part No. 90311-042LF
Description Crimp-to-Wire Housing, Double Row, Pol. w/Latch, 42 Position
Tech specs    

Official Product Page

    87835-5042

Molex Electronics Ltd.
Part No. 87835-5042
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 106.14K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-811042400LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87835-5043

Molex Electronics Ltd.
Part No. 87835-5043
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 92.96K  /  3 Page

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Amphenol Communications Solutions

Part No. U77A61042001
Description SFP 1X6 CAGE NI TRAY
Tech specs    

Official Product Page

    87835-1442

Molex Electronics Ltd.
Part No. 87835-1442
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 106.14K  /  3 Page

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Amphenol Communications Solutions

Part No. 77319-104-26LF
Description BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Double Row, 26 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

    87835-2442 0878352442

Molex Electronics Ltd.
Part No. 87835-2442 0878352442
Description 2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 24 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 106.14K  /  3 Page

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Amphenol Communications Solutions

Part No. 76345-104-24LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 24 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0878352642 87835-2642

Molex Electronics Ltd.
Part No. 0878352642 87835-2642
Description 2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 26 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 106.14K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-104200800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0878354042

Molex Electronics Ltd.
Part No. 0878354042
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 106.14K  /  3 Page

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Amphenol Communications Solutions

Part No. 10046971-042LF
Description Power Card Edge, Power Connectors, 2 x 35P STB Vertical.
Tech specs    

Official Product Page

    0878350842 87835-0842

Molex Electronics Ltd.
Part No. 0878350842 87835-0842
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 8 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating

File Size 106.48K  /  3 Page

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Amphenol Communications Solutions

Part No. U99B104200T
Description CFP2, Input Output Connectors, Receptacle CONNECTOR ASSY
Tech specs    

Official Product Page

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