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  A-70567-0014 Datasheet PDF File

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    A-70567-0014 15-80-0321

Molex Electronics Ltd.
Part No. A-70567-0014 15-80-0321
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, Tin (Sn) Plating

File Size 1,218.23K  /  7 Page

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Texas Instruments

Part No. SN0014HBL
Description Radiation-hardened, QMLV and QMLP, 1.5A ultra-low-noise high-PSRR low-dropout (LDO) regulator 14-CFP 25 to 25
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015800145 15-80-0145 70567-0141

Molex Electronics Ltd.
Part No. 0015800145 15-80-0145 70567-0141
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021512-00014T8LF
Description 1.27mm (0.05in.) pitch, Shrouded header, 14 contacts
Tech specs    

Official Product Page

    0015800147 15-80-0147 A-70567-0209

Molex Electronics Ltd.
Part No. 0015800147 15-80-0147 A-70567-0209
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating

File Size 1,218.31K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021621-00014T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 14 contacts
Tech specs    

Official Product Page

    0015800149 15-80-0149 A-70567-0277

Molex Electronics Ltd.
Part No. 0015800149 15-80-0149 A-70567-0277
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021121-10014D4LF
Description VERTICAL SMT TYPE HEADER
Tech specs    

Official Product Page

    15-80-0141 A-70567-0005 0015800141 705670005

Molex Electronics Ltd.
Part No. 15-80-0141 A-70567-0005 0015800141 705670005
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.38K  /  7 Page

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Amphenol Communications Solutions

Part No. 51710-014LF
Description PwrBlade®, Power Supply Connectors, 3P 16S 3P Vertical Header.
Tech specs    

Official Product Page

    A-70567-0279

Molex Electronics Ltd.
Part No. A-70567-0279
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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Amphenol Communications Solutions

Part No. 51770-014LF
Description PwrBlade®, Power Supply Connectors, 4P 24S 5P Right Angle Receptacle.
Tech specs    

Official Product Page

    70567-0018

Molex Electronics Ltd.
Part No. 70567-0018
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

File Size 1,218.45K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021211-00014T1LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 14 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    A-70567-0019

Molex Electronics Ltd.
Part No. A-70567-0019
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions

Part No. 51966-10014800AALF
Description PwrBlade®, Power Connectors, 148S Right Angle Header, Solder To Board
Tech specs    

Official Product Page

    A-70567-0020

Molex Electronics Ltd.
Part No. A-70567-0020
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, Tin (Sn) Plating

File Size 1,218.41K  /  7 Page

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Amphenol Communications Solutions

Part No. 68001-413HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 13 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    A-70567-0021

Molex Electronics Ltd.
Part No. A-70567-0021
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021122-00014D1LF
Description Minitek127® 1.27mm, Board To Board, Unshrouded header, Surface Mount, 14 contacts.
Tech specs    

Official Product Page

For A-70567-0014 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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