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  A-70567-0019 Datasheet PDF File

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    A-70567-0019

Molex Electronics Ltd.
Part No. A-70567-0019
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Texas Instruments

Part No. 80019012A
Description Quadruple 2-Input Positive-AND Gates With Open-Collector Outputs 20-LCCC -55 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    A-70567-0020

Molex Electronics Ltd.
Part No. A-70567-0020
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, Tin (Sn) Plating

File Size 1,218.41K  /  7 Page

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Texas Instruments

Part No. 8001901CA
Description Quadruple 2-Input Positive-AND Gates With Open-Collector Outputs 14-CDIP -55 to 125
Tech specs    

Official Product Page

    70567-0018

Molex Electronics Ltd.
Part No. 70567-0018
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

File Size 1,218.45K  /  7 Page

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Texas Instruments

Part No. HPA00194DGNR
Description 1.25-W Mono, Fully Differential, Class-AB Audio Amplifier 8-MSOP-PowerPAD -40 to 85
Tech specs    

Official Product Page

    A-70567-0279

Molex Electronics Ltd.
Part No. A-70567-0279
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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Texas Instruments

Part No. TLV70019DDCT
Description 200mA Low-Iq Low-Dropout (LDO) Regulator for Portables 5-SOT-23-THIN -40 to 125
Tech specs    

Official Product Page

    A-70567-0021

Molex Electronics Ltd.
Part No. A-70567-0021
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Texas Instruments

Part No. TLV70019DDCR
Description 200mA Low-Iq Low-Dropout (LDO) Regulator for Portables 5-SOT-23-THIN -40 to 125
Tech specs    

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Official Product Page

    70567-0125

Molex Electronics Ltd.
Part No. 70567-0125
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating

File Size 1,211.75K  /  7 Page

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Texas Instruments

Part No. 8001901DA
Description Quadruple 2-Input Positive-AND Gates With Open-Collector Outputs 14-CFP -55 to 125
Tech specs    

Official Product Page

    70567-0120

Molex Electronics Ltd.
Part No. 70567-0120
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

File Size 1,211.71K  /  7 Page

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Amphenol Communications Solutions

Part No. 65240-019LF
Description Dubox® 2.54mm Pitch, Board to Board Connector, Crimp-to-Wire Housing, Single Row.
Tech specs    

Official Product Page

    A-70567-0022

Molex Electronics Ltd.
Part No. A-70567-0022
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions

Part No. 88880-019
Description Quickie®, Wire to Board Connector, Double Row, 34 Positions, 2.54 mm (0.1 in.), Vertical, Shrouded Header 0.76 um (15 u\\.) Gold Plating
Tech specs    

Official Product Page

    70567-0143 15-80-0185

Molex Electronics Ltd.
Part No. 70567-0143 15-80-0185
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 10147606-00019LF
Description Minitek 1.0mm R/A SMT Header, 19 Positions, Tin Plating, Natural Color
Tech specs    

Official Product Page

    A-70567-0014 15-80-0321

Molex Electronics Ltd.
Part No. A-70567-0014 15-80-0321
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, Tin (Sn) Plating

File Size 1,218.23K  /  7 Page

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Amphenol Communications Solutions

Part No. 10119109-220019LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

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