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Rochester Electronics LLC |
| Part No. |
MD28F010-20/B
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| Description |
28F010 - 128K X 8 Flash, Mil Temp
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| Tech specs |
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Official Product Page
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Rochester Electronics LLC |
| Part No. |
AM27C010-200DM/B
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| Description |
AM27C010 - CMOS EPROM 1 Megabit (128K x 8)
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| Tech specs |
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Official Product Page
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Rochester Electronics LLC |
| Part No. |
MD28F010-25/B
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| Description |
28F010 - 128K X 8 Flash, Mil Temp
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75160-102-11LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,11 position, 2.54mm pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75160-102-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,6 position, 2.54mm pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-110102000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114828-10102LF
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| Description |
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127820-1021GLF
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| Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 10 Positions, GW Compatible Nylon66, Tray Packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127820-1022GPLF
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| Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 10 Positions, GW Compatible Nylon66, Tray Packing, With Pegs.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70567-0013 A-70567-0013 15-80-0301
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating
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| File Size |
1,218.41K /
7 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
75188-801-02LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical header, Through Hole, Single Row, 2 Positions, 5.08mm (0.200in) Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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