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  A-70567-0206 Datasheet PDF File

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    15-80-0087 0015800087 A-70567-0206

Molex Electronics Ltd.
Part No. 15-80-0087 0015800087 A-70567-0206
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.48K  /  7 Page

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Amphenol Communications Solutions

Part No. 75160-102-06LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,6 position, 2.54mm pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    A-70567-0021

Molex Electronics Ltd.
Part No. A-70567-0021
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions

Part No. G832MB030206324HR
Description Pitch 0.8mm, Height 11.7 mm, 20 Positions, Dual Row, BTB Vertical Receptacle SMT, 8u\\. Gold White
Tech specs    

Official Product Page

    70567-0125

Molex Electronics Ltd.
Part No. 70567-0125
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating

File Size 1,211.75K  /  7 Page

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Amphenol Communications Solutions

Part No. 68020-672
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70567-0120

Molex Electronics Ltd.
Part No. 70567-0120
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

File Size 1,211.71K  /  7 Page

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Amphenol Communications Solutions

Part No. 85720-206LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Press Fit, 5 Rows, 120 Positions.
Tech specs    

Official Product Page

    A-70567-0022

Molex Electronics Ltd.
Part No. A-70567-0022
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions

Part No. 66902-060LF
Description Quickie Header, Wire to Board Connector, Standard Dual Beam - Double row - 60 Positions - 2.54 mm (0.1 in.) .
Tech specs    

Official Product Page

    A-70567-0020

Molex Electronics Ltd.
Part No. A-70567-0020
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, Tin (Sn) Plating

File Size 1,218.41K  /  7 Page

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Amphenol Communications Solutions

Part No. 10007607-802-06LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled header ,Through Hole, Row Polarized ,Double row , 6 Positions ,2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    A-70567-0019

Molex Electronics Ltd.
Part No. A-70567-0019
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions

Part No. 75844-302-06LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70567-0018

Molex Electronics Ltd.
Part No. 70567-0018
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

File Size 1,218.45K  /  7 Page

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Amphenol Communications Solutions

Part No. 93689-102-06LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Press Fit, Single row , 6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    A-70567-0279

Molex Electronics Ltd.
Part No. A-70567-0279
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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Amphenol Communications Solutions

Part No. 95293-402-06LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Single Row,6 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70567-0143 15-80-0185

Molex Electronics Ltd.
Part No. 70567-0143 15-80-0185
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 68020-616
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For A-70567-0206 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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