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Molex Electronics Ltd.
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Part No. |
A-70567-0015 0015800341
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits, Tin (Sn) Plating
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File Size |
1,218.42K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10136655-0341LF
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Description |
Minitek® Pwr 3.0, Single Row, Right Angle SMT Tails and Hold Down Header, 30u\\ Gold (Tin on Tails) plating, 3 Positions, Black Color, GW Compatible LCP, Tape and Reel packing.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
A-70567-0341 15-80-1061 0015801061
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Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Plat 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10136647-034111LF
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Description |
Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, Nylon 66, 30u\\ Gold (Tin on Tails) plating, Natural Color, 3 Positions, GW Compatible, with Posts, Tray packing.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54122-110341550LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 34 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
86503-418HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 18 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
86503-414HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10136647-034112LF
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Description |
Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, Nylon 66, 30u\\ Gold (Tin on Tails) plating, Natural Color, 3 Positions, GW Compatible, with out Posts, Tray packing.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10137784-03411LF
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Description |
Minitek® Pwr 4.2 HCC, Single Row, Right Angle Through Hole Header, Nylon 66, 30u\\ Gold (Tin on Tails) plating, Natural Color, 3 Positions, GW Compatible, Tray packing.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10137785-034142LF
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Description |
Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, 30u\\ Gold (Tin on Tails) plating, Natural Color, 3 Positions, Non GW Compatible, without Post, Tray packing.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10136646-03413LF
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Description |
Minitek® Pwr 4.2, Single Row, Right Angle Through Hole Header, LCP, 30u\\ Gold (Tin on Tails) plating, Natural Color, 3 Positions, GW Compatible, with Posts, Tray packing.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10136656-0341LF
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Description |
Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 30u\\ Gold (Tin on Tails) plating, 3 Positions, Black Color, GW Compatible LCP, Tray packing.
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Tech specs |
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Official Product Page
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Price and Availability
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