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  C9730DK-1011 Datasheet PDF File

For C9730DK-1011 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    C9730DK-1011

Hamamatsu Corporation
Part No. C9730DK-1011
Description For soft X-ray imaging, cassette type with USB 2.0 interface Photodiode area: 52.8 × 52.8 mm
File Size 480.75K  /  8 Page

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Amphenol Communications Solutions
Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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HUA FENG CIRCUIT





    Hamamatsu Photonics K.K.
Part No. C9730DK-10
Description Large area soft X-ray imaging, high resolution 大面积软X射线成像，高分辨
File Size 83.72K  /  4 Page

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Amphenol Communications Solutions
Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    C9730DK-10

Hamamatsu Corporation
Part No. C9730DK-10
Description Large area soft X-ray imaging, high resolution
File Size 88.42K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114829-10110LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
Tech specs 　 　

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    ITT, Corp.
Part No. MZCK03P1011/KS35D
Description MAGNETIC FIELD SENSOR-MAGNETORESISTIVE, 4-4mT, 200mA, PA66
File Size 81.18K  /  1 Page

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Amphenol Communications Solutions
Part No. 10114831-10113LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
Tech specs 　 　

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    Integrated Circuit Technology Corp
Part No. MZTK06N1011/KS35D
Description MAGNETIC FIELD SENSOR-MAGNETORESISTIVE, 4-4mT, 200mA, RECTANGULAR
File Size 81.64K  /  1 Page

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Amphenol Communications Solutions
Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs 　 　

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    03-09-1011

Molex Electronics Ltd.
Part No. 03-09-1011
Description 2.36mm Diameter Standard
File Size 30.58K  /  1 Page

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Amphenol Communications Solutions
Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs 　 　

Official Product Page

    03-06-1011-P

Molex Electronics Ltd.
Part No. 03-06-1011-P
Description PLUG & RECEPTACLE HOUSINGS I CIRCUIT
File Size 113.41K  /  3 Page

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Amphenol Communications Solutions
Part No. 10114828-10115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs 　 　

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    MULTI CONTACT AG
Part No. 23.1011-23
Description INTERCONNECTION DEVICE
File Size 163.40K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114830-10111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs 　 　

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    03-06-1011

Molex Electronics Ltd.
Part No. 03-06-1011
Description 1.57mm Diameter Standard .062 Pin and Socket Receptacle Housing, 1 Circuits
File Size 30.14K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114829-10115LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
Tech specs 　 　

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    EM-1011

Asahi Kasei Microsystems
Part No. EM-1011
Description EM-1011 is ultra-small Hall effect ICs of a single silicon chip composed of Hall element and a signal processing IC
File Size 129.12K  /  3 Page

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Amphenol Communications Solutions
Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

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