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12104 M4565 C847B 0G471 JHV21H80 W83L784R ON1933 AON6594
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  CLA-18-6005 Datasheet PDF File

For CLA-18-6005 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Teledyne Technologies Incorporated.
Part No. CLA-18-6005
Description Low Noise Amplifier 6 GHz - 18 GHz

File Size 887.80K  /  2 Page

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Amphenol Communications Solutions

Part No. 65846-005LF
Description PV® Wire-to-Board Connector System, Mini Latching, Double Row, 54 Positions, Polarized, 2.54 mm (0.100in) Pitch, Housing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Teledyne Technologies Incorporated.
TELEDYNE[Teledyne Technologies Incorporated]
Part No. CLA-18-6006 CLA-18-6005
Description Low Noise Amplifier 6 GHz - 18 GHz

File Size 887.67K  /  2 Page

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Amphenol Communications Solutions

Part No. 10106131-4006005LF
Description PwrBlade+®,Power Connectors,2HP+24S+2HP Press Fit Vertical Receptacle
Tech specs    

Official Product Page

    PM75CLA060 PM75CLA06005

Mitsubishi Electric Sem...
Mitsubishi Electric Semiconductor
Part No. PM75CLA060 PM75CLA06005
Description FLAT-BASE TYPE INSULATED PACKAGE

File Size 115.38K  /  8 Page

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Amphenol Communications Solutions

Part No. G800LQ306005EU
Description Board mount - Header Plug - Pin Header 2.54mm Pitch STR DIP,1x2Pin,15u\\ Gold,LCP, 6.0mm*2.54mm*3.0mm,Color-Black
Tech specs    

Official Product Page

    PM100CLA06005

Mitsubishi Electric Semiconductor
Part No. PM100CLA06005
Description FLAT-BASE TYPE INSULATED PACKAGE

File Size 115.46K  /  8 Page

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Amphenol Communications Solutions

Part No. G800W306005EU
Description Board mount - Header Plug - Pin Header 2.54mm Pitch STR DIP,1x2Pin,15u\\ Gold,NY6T,6.1mm*2.5mm*3.0mm,Color-Black,BAG
Tech specs    

Official Product Page

    PM200CLA060 PM200CLA06005

Mitsubishi Electric Semiconductor
Part No. PM200CLA060 PM200CLA06005
Description INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE

File Size 125.10K  /  8 Page

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Amphenol Communications Solutions

Part No. 324-6005-065
Description GbX ,Backplane connectors,2 pair, 5 position, open, 5.55mm, Header
Tech specs    

Official Product Page

    PM150CLA06005

Mitsubishi Electric Semiconductor
Part No. PM150CLA06005
Description INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE

File Size 115.79K  /  8 Page

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Amphenol Communications Solutions

Part No. 325-6005-B64
Description GbX ,Backplane connectors,2 pair, 5 position, right, B-Key, 4.55mm, Header
Tech specs    

Official Product Page

    PM300CLA06005

Mitsubishi Electric Semiconductor
Part No. PM300CLA06005
Description INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE

File Size 116.57K  /  8 Page

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Amphenol Communications Solutions

Part No. 325-6005-E65
Description GbX ,Backplane connectors,2 pair GBX, 5 pos, right, E-Key, 5.55mm, Header
Tech specs    

Official Product Page

   
Part No. CLA-SER
Description ASIC

File Size 452.10K  /  5 Page

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Amphenol Communications Solutions

Part No. 335-6005-A65
Description GbX ,Backplane connectors,3 pair, 5 position, right, A-Key, 5.55mm, Header
Tech specs    

Official Product Page

    CLA-EP7

Ferroxcube International Holding B.V.
Part No. CLA-EP7
Description CLA-EP7

File Size 26.31K  /  1 Page

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Amphenol Communications Solutions

Part No. 335-6005-E63
Description GbX ,Backplane connectors,3 pair GBX, 5 pos, right, E-Key, 3.55mm, Header
Tech specs    

Official Product Page

    CLA-E20

Ferroxcube International Holding B.V.
Part No. CLA-E20
Description CLA-E20

File Size 31.97K  /  1 Page

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Amphenol Communications Solutions

Part No. 335-6005-H64
Description GbX ,Backplane connectors,3 pair, 5 position, right, H-Key, 4.55mm, Header
Tech specs    

Official Product Page

For CLA-18-6005 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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