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Rochester Electronics LLC |
| Part No. |
2910/BQA
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| Description |
2910 - Microprogram Controller - Dual marked (7801701QA)
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| Tech specs |
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Official Product Page
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Rochester Electronics LLC |
| Part No. |
2910A/BQA
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| Description |
2910A - Microprogram Controller - Dual marked (7801702QA)
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Official Product Page
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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TCK22910G
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| Description |
Load Switch IC, 1.1 to 5.5 V, 2.0 A, Reverse current blocking, WCSP6E
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| Tech specs |
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Official Product Page
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| Part No. |
EHA2-2620-1 EHA2-2600-1 EHA0-2600-6 EHA2-2600-5 EHA7-2600-2 EHA7-2600-5 EHA7-2600/883B EHA7-2620-2 EHA7-2620-5 EHA7-2620/883B
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| Description |
Voltage-Feedback Operational Amplifier
Volatile Digitally Controlled Potentiometer (XDCP™); Terminal Voltage ±3V or ±5V, 128 Taps I2C Serial Interface; Temperature Range: -40°C to 85°C; Package: 10-MSOP
39µA Micropower Single and Dual Precision Rail-to-Rail Input-Output (RRIO) Low Input Bias Current Op Amps; Temperature Range: Full-Range; Package: 8-SOIC
Dual and Quad Micropower Single Supply Rail-to-Rail Input and Output (RRIO) Op Amp; Temperature Range: Full-Range Ind; Package: 10-MSOP
Dual Micropower Single Supply Rail-to-Rail Input and Output (RRIO) Precision Op Amp; Temperature Range: Full-Range Ind; Package: 10-MSOP
Quad Channel Micro-power, Single Supply, Rail-to-Rail Input and Output (RRIO) Instrumentation Amplifier; Temperature Range: Full-Range Ind; Package: 28-QSOP
Micropower, Single Supply, Rail-to-Rail Input-Output Instrumentation Amplifier and Precision Operational Amplifier; Temperature Range: Full-Range; Package: 24-QSOP
Single and Dual Ultra-Low Noise, Rail-to-Rail, Op Amp; Temperature Range: Full-Range Ind; Package: 10-MSOP
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| File Size |
831.46K /
15 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
70229-102LF
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| Description |
4 Row,96 Posn Signal Receptacle, Right Angle, Solder-to-Board
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114829-10102LF
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| Description |
1.25mm Wire to Board Wafer, Vertical, Through Hole, 2 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114829-10108LF
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| Description |
1.25mm Wire to Board Wafer, Vertical, Through Hole, 8 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114829-10106LF
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| Description |
1.25mm Wire to Board Wafer, Vertical, Through Hole, 6 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114829-10103LF
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| Description |
1.25mm Wire to Board Wafer, Vertical, Through Hole, 3 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-129-10LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 10 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54602-910LF
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| Description |
Modular Jack, Input Output Connectors, Cat 3 Single Modular Jack, Horizontal, Board Through Mount, 10P10C, 1 Port
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| Tech specs |
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Official Product Page
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