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Amphenol, Corp.
MOSAIC
http://
Fujitsu, Ltd.
NXP Semiconductors N.V.
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| Part No. |
SYS32512ZK-010 SYS32512ZK-012 SYS32512ZK-015 SYS32512LK-010 SYS32512LK-012 SYS32512LK-015 SYS32512LKI-010 SYS32512LKI-012 SYS32512LKI-015 SYS32512LKXA-010 SYS32512LKXA-012 SYS32512LKXA-015 SYS32512LKXAI-010 SYS32512LKXAI-012 SYS32512LKXAI-015 SYS32512ZKI-010 SYS32512ZKI-012 SYS32512ZKI-015
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| OCR Text |
...low and /WE going low ; A write ends at the earliest transition /CS going high or /WE going high. tWP is measured from the beginning of write to the end of write. 3. tCW is measured from the later of /CS going low to end of write. 4. tAS is... |
| Description |
512 K x 32 Static RAM
512K X 32 MULTI DEVICE SRAM MODULE, 12 ns, PZMA72 PLASTIC, ZIP-72
512K X 32 MULTI DEVICE SRAM MODULE, 10 ns, PZMA72 PLASTIC, ZIP-72
512K X 32 MULTI DEVICE SRAM MODULE, 12 ns, PSMA72 PLASTIC, SIMM-72
512K X 32 MULTI DEVICE SRAM MODULE, 10 ns, PSMA72 PLASTIC, SIMM-72
512 K x 32 Static RAM 512亩32静态RAM
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| File Size |
255.87K /
11 Page |
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